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25.06.26 - 06:06
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TSMC-Amkor alliance jolts packaging map as ASE races to expand (Digitimes)
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The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to diversify supply-chain risk make deeper global investment inevitable....
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