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08.12.25 - 05:48
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Geopolitics push AI chip packaging into Taiwan-US duopoly (Digitimes)
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Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip packaging capacity will consolidate around two critical hubs: Taiwan and the United States. The key beneficiaries are expected to be ASE Holdings and Siliconware Precision Industries (SPIL) in Taiwan, and Amkor Technology in the US and South Korea....
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03.12.25 - 04:06
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Intel taps Amkor in Korea for advanced chip packaging (Digitimes)
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Intel is reportedly outsourcing the advanced packaging of its artificial intelligence semiconductors to Amkor Technology Inc.'s facility in Incheon, South Korea, marking the first time the US chip giant has relied on an external partner for this critical process, according to South Korea's ET News....
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20.11.25 - 05:06
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Amkor invests US$177M to expand AI chip packaging in South Korea (Digitimes)
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Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to expand capacity for rising AI chip demand. The company said it will increase back-end production in Songdo, Incheon, where it already runs a key advanced packaging facility....
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20.11.25 - 05:06
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Nvidia partners with Amkor, SPIL, and Menlo Micro to boost US IC backend capacity (Digitimes)
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Nvidia has announced key partnerships to expand its supply chain and manufacturing capacity in the US, aiming to meet rising global demand for artificial intelligence (AI) computing chips. The company is collaborating with Amkor Technology and Taiwan's SPIL to scale up domestic packaging operations, alongside launching a new testing chip technology with startup Menlo Micro....
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