|
|
|
|
|
|
|
15.10.26 - 06:06
|
Memory crisis drives global smartphone shipments down 20%, deepening premium-budget divide (Digitimes)
|
|
|
Global smartphone shipments fell 20% year-on-year in the third quarter of 2026, their lowest 3Q level since 2012, as persistent DRAM and NAND shortages inflated production costs, constrained supply, and weakened demand. Samsung led with a 23% market share, while Apple reached a record third-quarter share of 22%, highlighting a widening divide between premium and price-sensitive segments....
|
|
|
15.10.26 - 05:06
|
Premium PC demand fuels tandem OLED race between Samsung Display, LG Display (Digitimes)
|
|
|
Competition in the global PC market is shifting from a focus on shipment volumes of low-cost models towards premium, high-performance devices, intensifying the race in OLED display technology. Tandem OLED, which combines higher brightness, longer lifespan, and lower power consumption, is emerging as a key technology for premium PCs, sharpening competition between South Korea's two leading panel makers, Samsung Display (SDC) and LG Display (LGD)....
|
|
|
|
|
15.10.26 - 04:06
|
Nvidia′s Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift (Digitimes)
|
|
|
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics and SK hynix to increase supplies of 8-layer products. The differing assessments suggest that changes in memory configurations do not necessarily signal weaker HBM demand, as manufacturing constraints and supply shortages are expected to support memory prices in 2027....
|
|
|
|
|
|
|
15.10.26 - 02:30
|
UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry (Digitimes)
|
|
|
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that was ultimately turned down. As a result, Samsung scaled back its September 2026 component production volume by 10%. Amid persistent capacity tightness at mature process nodes, Samsung is now evaluating GlobalFoundries (GF) as a secondary foundry partner for its OLED smartphone DDIs, with potential adoption set for late 2027 at the earliest....
|
|
|
|
|
|
|
14.10.26 - 09:42
|
Marcus Weyerer: Warum die Schaufeln des KI-Goldrauschs aus Taiwan und Südkorea kommen (Das Investment)
|
|
|
Franklin-Templeton-Stratege Marcus Weyerer sieht Schwellenländer an der engsten Stelle der KI-Wertschöpfung. Die Auftragsbücher reichen bis 2027 – das Klumpenrisiko wächst mit.Die Modelle der weltweiten KI-Revolution kommen aus den USA. Die Chips darunter allerdings nicht. 80 Prozent der Speicherchips entstehen in Südkorea, bei SK Hynix und Samsung. Von den Rechenchips, die für KI zählen, kommen über 90 Prozent aus Taiwan, der Großteil von TSMC. Wer eine KI trainieren will, kommt deshalb an Asien nicht vorbei. Das rückt zwei Schwellenländer (Emerging Markets) ins Zentrum der Rallye und räumt zugleich mit dem Bild auf, das viele Anleger im Kopf haben: Rohstoffe, junge Bevölkerung, Brasilien. Marcus Weyerer, ETF-Stratege bei Franklin Templeton, hält......
|
|
|
14.10.26 - 08:13
|
ASML Raises Full-Year Sales Outlook (Bloomberg)
|
|
|
ASML upgraded the low end of its 2026 sales forecast as increasing artificial intelligence spending boosts demand for the Dutch company's chip-making machines. The firm projected annual sales of between €44 billion ($49 billion) and €45 billion this year. ASML's outlook offers an indication of investment plans by chipmakers like TSMC, Samsung Electronics and Intel. Bloomberg's Tom Mackenzie reports. (Source: Bloomberg)...
|
|
|
14.10.26 - 07:06
|
Samsung, AMD validate CXL memory for AI servers (Digitimes)
|
|
|
Samsung Electronics and AMD have collaborated to validate Compute Express Link (CXL) memory technology designed to expand capacity and bandwidth for AI servers, as Samsung broadens its AI infrastructure strategy beyond high-bandwidth memory (HBM) to memory pooling and enterprise storage....
|
|
|
|
|
|
|
14.10.26 - 04:06
|
Samsung integrates AI into daily life as LG showcases smart factories, data-center cooling (Digitimes)
|
|
|
Samsung Electronics and LG Electronics showcased their AI strategies at KES 2026 in South Korea, with Samsung focusing on smartphones, TVs, and home appliances while emphasizing an integrated AI ecosystem for everyday life. LG highlighted smart factories, robotic components, and data center cooling systems, demonstrating how its manufacturing and heating, ventilation, and air-conditioning (HVAC) expertise is expanding into AI-related industries....
|
|
|
|
|
|
|
13.10.26 - 19:01
|
Spekulation um exklusiven Speicherchip aus China (Börsen-Zeitung)
|
|
|
Der chinesischen Firma CXMT ist gelungen, woran sich die Technologieriesen Samsung und SK Hynix seit Jahren die Zähne ausbeißen – behauptet zumindest der Firmenchef. Mit der neuen Technik könnten zudem westliche Sanktionen weiter an Wirkung verlieren....
|
|
Börsentreff auf Facebook |
Börsentreff auf X |
Börsentreff auf Instagram
