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15.11.26 - 02:12
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Samsung’s $34 Billion HBM Bet Raises Memory Glut Risks (24/7 Wall St.)
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Samsung's ₩46 trillion HBM packaging investment will not begin operations until 2028, leaving current memory shortages largely unaffected. New manufacturing capacity from Samsung, SK hynix, and Micron could significantly alter memory supply conditions during 2028–2029. Memory manufacturers face the risk that today's aggressive capital spending will produce excess capacity if HBM demand growth moderates. Samsung's […]...
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13.11.26 - 10:06
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DEEPX tapes out AI chip on Samsung′s 2nm process (Digitimes)
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South Korean AI chip developer DEEPX has completed the tape-out of its next-generation DX-M2 processor using Samsung Electronics' second-generation 2nm process, advancing plans to bring generative AI to robots and industrial equipment while reducing their reliance on cloud computing....
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13.11.26 - 08:06
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Samsung reportedly wins more AI chip orders from US cloud firms (Digitimes)
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Samsung Electronics has reportedly secured new AI chip manufacturing orders from major US cloud service providers for a second consecutive quarter, with commercial shipments expected to begin in 2028 as tight capacity at TSMC creates opportunities for Samsung's foundry business....
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