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16.06.26 - 00:06
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SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead (Digitimes)
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SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later than July 2026....
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15.06.26 - 11:06
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Micron CEO turns visa rejection into US$1 trillion milestone (Digitimes)
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Nvidia CEO Jensen Huang's recent trip to South Korea put the spotlight on the rivalry between Samsung Electronics and SK Hynix, while memory giant Micron crossed the US$1 trillion market-cap mark for the first time. That shift has also drawn global attention to Micron CEO Sanjay Mehrotra, whose rise began with a string of dramatic visa rejections 50 years ago....
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15.06.26 - 10:06
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South Korea′s chip equipment players ride the HBM4 wave (Digitimes)
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South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new contracts and revenue rebounds for domestic suppliers, according to executives and industry reporting....
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15.06.26 - 08:06
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SK Hynix to test ChatGPT and Copilot as Samsung widens enterprise AI use (Digitimes)
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SK Hynix said it is evaluating external generative AI models, including ChatGPT Enterprise and Microsoft Copilot, as it pilots broader AI use across the company, following Samsung Electronics' recent rollout of external generative AI services for employees. The move was disclosed during an internal briefing on the semiconductor maker's AI transformation plans and is aimed at extending AI from support tasks into decision-making, research and development, and wider operations....
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15.06.26 - 07:06
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Google′s TPU diversification challenges MediaTek and other ASIC partners (Digitimes)
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Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end wafer manufacturing to broaden its capacity sources....
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15.06.26 - 07:06
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Samsung′s Exynos 2600 doubles on-device AI performance in MLPerf benchmarks (Digitimes)
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Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and image-generation workloads....
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