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30.09.26 - 05:06
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AMD′s Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties (Digitimes)
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Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory cooperation with Samsung Electronics. The planned visit is expected to broaden that push, with meetings lined up with South Korean AI chip companies and government officials as AMD deepens its AI semiconductor alliance in the country....
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30.09.26 - 02:48
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Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs (Digitimes)
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Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at the center of foldable-phone competition and could pressure Samsung to reconsider its technology roadmap....
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30.09.26 - 02:48
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Memory shortage pushes TV semiconductors above panel costs (Digitimes)
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A global memory shortage linked to rising AI infrastructure spending has upended TV manufacturing economics, with semiconductor costs now overtaking display panels in some models. The shift, reported by ET News, could squeeze profitability at major TV makers including Samsung Electronics and LG Electronics....
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29.09.26 - 12:01
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Samsung steigt bei Nvidia-Partner Helix ein (Ariva)
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Samsung investiert eine Milliarde US-Dollar in die von Nvidia und KKR unterstützte KI-Firma Helix. Davon könnte der Konzern gleich mehrfach profitieren. Samsung und fünf Tochtergesellschaften investieren gemeinsam eine Milliarde US-Dollar in Helix Digital Infrastructure – ein erst im Juni gegründetes Infrastrukturunternehmen, hinter dem unter anderem KKR und Nvidia stehen. Allein Samsung steuert 500 Millionen US-Dollar bei. Die ......
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29.09.26 - 11:06
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Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5 (Digitimes)
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Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific development to the core technology behind D0a, its first sub-10nm DRAM generation. Industry observers believe Samsung's push to commercialize B1b DRAM earlier could also benefit its next-generation high-bandwidth memory (HBM) products, including HBM5....
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29.09.26 - 07:00
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Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion (Digitimes)
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Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance computing (HPC) markets. Part of the funding reportedly comes from advance payments by Nvidia and other global technology companies. With Samsung Electro-Mechanics having already entered Nvidia's NVSwitch and Groq 3 supply chains, the two companies' cooperation is expected to extend from an existing supply relationship to dedicated capacity....
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