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12.10.26 - 11:06
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Samsung reportedly locks up to 80% of 2027 memory supply into long-term deals (Digitimes)
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Samsung Electronics has committed 75–80% of its 2027 memory supply, including high-bandwidth memory (HBM), to long-term agreements (LTAs), the Korea Economic Daily reported on October 9, 2026, citing industry sources. Nvidia, Google and Microsoft were among the major customers that had largely finalized contracts. Samsung has not confirmed the allocation or named the buyers....
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12.10.26 - 09:15
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GMIF2026 Annual Awards Unveiled: Samsung, Sandisk, Lenovo, Silicon Motion, BIWIN, and More Recognized (PR Newswire)
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SHENZHEN, China, Oct. 12, 2026 /PRNewswire/ -- The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026, GMIF2026) recently concluded at the Renaissance Shenzhen Bay Hotel, co-hosted by the Shenzhen Memory Industry Association (SMIA) and the School of Integrated Circuits,......
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12.10.26 - 09:06
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Samsung could unseat SK Hynix as HBM leader in 2027 (Digitimes)
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Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited DRAM production capacity, according to forecasts presented at an October 6 semiconductor industry forum in Seoul....
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12.10.26 - 04:06
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Weekly news roundup: From October 5 to October 11, 2026 (Digitimes)
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This week's coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces manufacturing, packaging, printed circuit board (PCB) yield, partnership, and governance questions, while Intel remains involved and TSMC's role may be limited. Samsung reportedly advances HBM4E high-bandwidth memory validation and glass interposer testing. Vicor expands patent litigation over AI server power systems. Taiwan restricts China-made fiberglass sleeves, and China's new five-year plan prioritizes advanced PCBs, materials, equipment, and domestic investment....
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12.10.26 - 02:36
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China′s CXMT unveils ′key progress′ on chip structure pursued by Samsung, SK Hynix (SCMP)
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China's memory chip giant ChangXin Memory Technologies (CXMT) has reported “key progress” in a new structure that rivals Samsung Electronics and SK Hynix are also working on to boost memory density.
CXMT planned to roll out a new server-memory product based on the structure by the end of 2026, president Cao Kanyu said at an industrial event in Shanghai over the weekend, according to a company statement.
At the centre of the development is the “4F square” design, in which each memory cell......
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