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01.09.26 - 09:06
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Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan (Digitimes)
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As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first appearance at SEMICON Taiwan 2026, with advanced packaging and glass substrate expert Gang Duan traveling to Taiwan to unveil the company's roadmap for next-generation advanced packaging substrates aimed at AI infrastructure....
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01.09.26 - 05:06
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Samsung locks 70% of memory output as HBM spot prices soar (Digitimes)
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Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high bandwidth memory (HBM) tightens the broader chip shortage. In some cases, spot prices for memory products are now as much as 5 times the LTA contract price....
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01.09.26 - 02:06
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Samsung is said to develop 8-layer HBM4E for Nvidia′s NVHBM push (Digitimes)
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Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM platform. According to Seoul Economic Daily, the shift could give Samsung an early position in the next-generation artificial intelligence memory market if development moves ahead smoothly....
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01.09.26 - 02:06
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Samsung weighs HBM4 bonuses as memory, foundry teams align (Digitimes)
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Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly established Device Solutions (DS) special management performance bonus system. Labor and management are now negotiating detailed payout rules to clarify how One Team participants and some contract workers will be rewarded and to prevent employees from being disadvantaged because they belong to different units....
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