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13.02.26 - 03:06
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SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI (Digitimes)
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SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung focused on cross-domain semiconductor integration to address bandwidth and energy-efficiency limits, while SK Hynix detailed a platform-based and AI-driven approach to compress development cycles....
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12.02.26 - 08:15
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Samsung Begins Commercial Delivery of HBM4 Chips to Customers (AAStocks)
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South Korea's Samsung Electronics started the commercial delivery of the latest version of HBM4 memory chips to an unnamed customer, marking a strategic lead for Samsung in the highly competitive AI memory market.Prior to this, SK Hynix had been technically leading and monopolizing Nvidia's (NVDA.US) high-bandwidth memor......
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