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10.10.26 - 08:36
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Semco moves glass substrates to package-level testing (Digitimes)
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Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking progress toward commercializing next-generation packaging technology as AI accelerators grow larger and more complex. The development comes as the company expands its existing semiconductor substrate business while facing uncertainty over the commercialization timeline for glass substrates....
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09.10.26 - 10:45
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Report: Samsung Cuts 4Q Smartphone Output as Memory Costs Surge (AAStocks)
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According to South Korean media outlet Money Today, Samsung has notified suppliers to reduce smartphone production for 4Q this year by 20% to 30% in response to narrowing profit margins for certain models caused by rising memory costs. The report said Samsung had previously expected to produce about 270 million smartphones in 20......
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09.10.26 - 04:06
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Samsung HBM4E wins NVIDIA nod for AI accelerator push (Digitimes)
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Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale data center operators. If confirmed, the result would strengthen Samsung's bid to supply memory for next-gen AI accelerators, though order timing and mass production plans remain unclear....
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