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12.12.25 - 08:06
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Huawei, Samsung, and Apple escalate race for next-generation foldable smartphones (Digitimes)
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Competition in the foldable smartphone market is accelerating as Huawei, Samsung Electronics, and Apple advance new device plans aimed at reshaping the high-end segment. Huawei has begun global sales of its latest ultra-thin Mate X7, Samsung's first tri-fold device, which sold out immediately in South Korea, and Apple is preparing to debut its long-anticipated foldable iPhone in 2026, according to industry sources and analysts....
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12.12.25 - 07:06
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Samsung reportedly accelerates Pyeongtaek expansion to ramp up HBM4 and 1c DRAM production (Digitimes)
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Samsung Electronics is reportedly accelerating construction at its Pyeongtaek semiconductor complex to expand production of next-generation high-bandwidth memory, aiming to secure supply for global cloud providers and AI chipmakers as demand intensifies. The company has reportedly approved plans to convert additional space in its P4 fab into dedicated 1c DRAM lines and has advanced completion dates for key production zones, according to Korean media reports....
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11.12.25 - 20:24
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Samsung wants India to lead global design, production and innovation efforts (Times of India)
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Celebrating three decades in India, Samsung is deepening its manufacturing, design, and innovation initiatives, aiming to build and innovate products for the world from India. The company, which has filed 14,000 patents from India, is focusing its future vision on AI to drive smart homes and connected living, contributing to a digitally-empowered nation....
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11.12.25 - 17:06
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China′s Huawei ramps up foldable smartphone battle with global launch of slim Mate X7 (SCMP)
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Huawei Technologies is reinforcing its position in the foldable smartphone segment with the global launch of the Mate X7, as the market awaits Apple's much-anticipated foldable iPhone and digests the recent announcement of Samsung Electronics' first trifold.
The Huawei Mate X7, which was released in China last month, features a thickness of 4.5mm when unfolded. The device, including the battery, weighs up to 236 grams.
It was rolled out globally at an event in Dubai on Thursday. Featuring a......
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11.12.25 - 06:06
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South Korea targets new fabs, HBM leadership, fabless revamp in US$468bn chip push (Digitimes)
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South Korea has unveiled an expansive semiconductor strategy to secure its lead in next-generation memory and revive weaker segments such as logic chips and the domestic fabless sector. President Lee Jae-myung chaired a high-level government meeting with Samsung Electronics, SK Hynix, and policymakers, underscoring the urgency of reinforcing national competitiveness as global demand for AI semiconductors surges....
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11.12.25 - 04:06
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SK Hynix reaps largest benefits from H200 export approval (Digitimes)
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US President Donald Trump has allowed Nvidia's H200 chips to be exported to China, benefiting Samsung Electronics and SK Hynix. iNews24 and IT Chosun reported that with the high likelihood that Chinese AI companies will see increased chip demand, the US easing of restrictions is expected to boost H200 shipments. SK Hynix is reportedly the primary supplier of the fifth-generation high-bandwidth memory (HBM3E) used in the H200, meaning its supply volume will inevitably rise, making it the biggest beneficiary....
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09.12.25 - 08:06
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Samsung′s Exynos 2600 debut in Galaxy S26 may be Korea-only (Digitimes)
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Samsung Electronics will debut its new 2nm Exynos 2600 processor in the Galaxy S26 series, but deployment may be largely limited to South Korea. Contractual ties with Qualcomm, production yield challenges, and consumer perceptions of Exynos performance could restrict the chip's broader adoption, potentially affecting Samsung's control over its flagship device supply chain....
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09.12.25 - 05:06
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SK Hynix adopts hybrid bonding for 300-layer NAND to challenge Samsung (Digitimes)
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South Korean memory giant SK Hynix is fast-tracking the development of its next-generation 300-layer V10 NAND flash memory, according to reports in Korean media outlets Hankyung and Nate. The company plans to implement hybrid bonding technology for the first time to compete more effectively with rivals such as Samsung Electronics, China's YMTC, and Japan's Kioxia. Industry sources cited by Hankyung indicate that the company aims to complete development of a pilot line in 2026, before commencing mass production in early 2027....
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09.12.25 - 05:06
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Samsung′s HBM4 edge fuels foundry recovery (Digitimes)
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Samsung Electronics, with its sixth-generation high-bandwidth memory (HBM4), uses base dies produced by Samsung Foundry. As Samsung's HBM4 competitiveness rises, the market expects the performance of Samsung Foundry to improve in tandem. Increased HBM4 sales not only boost the memory business but also drive foundry revenue, demonstrating Samsung's advantage as an integrated device manufacturer (IDM)....
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09.12.25 - 02:36
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Samsung moves to narrow gap with TSMC as silicon photonics race heats up (Digitimes)
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Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with TSMC. The company is expanding its global research network and targeting the commercialization of co-packaged optics in 2027. Industry sources say that the timeline will mark the beginning of direct competition with its Taiwanese rival in next-generation packaging....
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08.12.25 - 17:48
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Wyld Networks announce change in management and a focus on growth (Cision)
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Wyld Networks announces the resignation of Alastair Williamson, as Chief Executive Officer (CEO) from the Company. Kjell Olovsson will take the position of CEO from the first of January 2026 until further notice.
Kjell Olovsson was born in Stockholm in 1968 and started his career as an engineer at Ericsson and most recently held the position of CEO of Bluetest AB for the last 15 years. Kjell built Bluetest into a world leading company in the wireless mobile testing market doing business with companies such as Samsung, Apple, Ericsson, Microsoft, Nokia and Google. Previously he worked in...
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