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17.02.26 - 07:00
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Abgänge bei Samsung: PR-Abteilung im Zerfall (Inside Paradeplatz)
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Kündigungen, Ausfälle, Funkstille bei Schweizer Ableger des Handy-Multis.
In der Schweizer Niederlassung von Samsung scheint derzeit weniger Hightech als Hochspannung im Umlauf zu sein. Nicht in den Akkus, sondern in der Marketingabteilung. Seit geraumer Zeit berichten Insider von einer Arbeitsatmosphäre, die eher an eine Reality-Show ohne Kameras erinnert […]...
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17.02.26 - 01:06
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Samsung accelerates HBM hybrid bonding line to meet Nvidia demand (Digitimes)
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Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus in South Korea to support the higher stacking transition to high-bandwidth memory 4 (HBM4) and next-generation high-bandwidth memory 5 (HBM5)....
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16.02.26 - 10:36
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Ray Wang on How AI Is Causing DRAM Prices to Surge | Odd Lots (Bloomberg)
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For years, DRAM — or Dynamic Random Access Memory — was kind of a sleepy, commoditized aspect of chip industry. Growth was steady, but modest, and prices just generally drifted lower. Suddenly all that's changed. AI has created voracious demand for DRAM and consumer facing companies are being forced to either curtail supply or raise prices due to exploding costs. But what is it about AI that consumes so much memory, and when will the market rebalance itself? On this episode, we speak with Ray Wang, an analyst at SemiAnalysis, who recently co-authored a report titled, Memory Mania: How a Once-in-Four-Decades Shortage Is Fueling a Memory Boom. We discuss the implications of this memory boom, how producers are responding to surging prices, and whether or not the Chinese companies in the space can catch up to the Korean giants, such as Samsung and Hynix. (Source: Bloomberg)...
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13.02.26 - 03:06
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SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI (Digitimes)
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SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung focused on cross-domain semiconductor integration to address bandwidth and energy-efficiency limits, while SK Hynix detailed a platform-based and AI-driven approach to compress development cycles....
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