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02.09.26 - 11:06
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DRAM giants target 3D stacking to break memory wall and power bottlenecks (Digitimes)
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At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching a performance ceiling. Consequently, the industry is transitioning toward 3D vertical stacking architectures to minimize transmission power consumption and leverage wafer-level bonding technologies....
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02.09.26 - 06:06
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SDC to expand foldable iPhone OLED mass production in September (Digitimes)
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Samsung Display (SDC) is expected to formally expand mass production of OLED panels for Apple's foldable iPhone starting in September 2026. Although the ramp-up for the foldable iPhone had previously been pushed back because production delays hit some components, including the hinge and substrate, the new OLED mass production schedule suggests SDC can still meet its full-year production target....
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01.09.26 - 09:06
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Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan (Digitimes)
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As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first appearance at SEMICON Taiwan 2026, with advanced packaging and glass substrate expert Gang Duan traveling to Taiwan to unveil the company's roadmap for next-generation advanced packaging substrates aimed at AI infrastructure....
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