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16.04.26 - 10:06
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Samsung pushes HBM4 yields as advanced testing and cutting technologies emerge (Digitimes)
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Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According to Chosun Biz, yields for Samsung's latest 10nm-class 1c DRAM have surpassed the industry's "mature yield" threshold of around 80%, indicating meaningful progress at the wafer level....
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16.04.26 - 09:01
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ASML: SK Hynix, Samsung und TSMC wollen mehr – jetzt kaufen? (Der Aktionaer)
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ASML ist mit überraschend viel Schwung in das neue Jahr gestartet und erzielte Umsatzrekorde bei Maschinen für Speicherchips sowie im Service-Geschäft. Der Anlagenbauer für die Halbleiterbranche profitiert weiterhin von steigenden Investitionen in das Thema KI – vor allem in Südkorea und Taiwan....
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16.04.26 - 07:06
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Tesla AI5 tape-out signals dual sourcing with Samsung, TSMC (Digitimes)
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Tesla has finalized the design of its next-generation AI5 chip, marking a milestone in its in-house semiconductor development. CEO Elon Musk confirmed the tape-out in a post on X, saying the design has been sent to foundry partners for fabrication. Musk also said Tesla is developing follow-on processors, including AI6 and Dojo3....
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