|
|
|
|
|
28.08.26 - 06:06
|
Samsung eyes zHBM products from 2029 as heat remains key hurdle (Digitimes)
|
|
|
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial product window. Heat remains a key engineering hurdle as Samsung works to stack HBM directly above AI accelerators....
|
|
|
|
|
|
|
28.08.26 - 02:42
|
Samsung absorbs memory costs to chase smartphone crown (Digitimes)
|
|
|
Global smartphone shipments are set to shrink sharply in 2026 as soaring memory and core component prices hit the market, but Samsung Electronics is moving in the opposite direction. Rather than passing costs fully on to consumers like some rivals, Samsung plans to keep shipment volume steady through the Galaxy S26, Galaxy Z Fold 8, and Galaxy A series, and could even retake the No. 1 spot in global smartphone shipments....
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
27.08.26 - 06:12
|
SK Hynix questions PIM as thermal, packaging limits constrain HBM (Digitimes)
|
|
|
South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory (PIM) as its core solution, SK Hynix is prioritizing packaging interconnect innovation to streamline data movement....
|
|
|
27.08.26 - 05:06
|
Tri-fold, rollable foldables intensify materials supply chain battle (Digitimes)
|
|
|
Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology showcase. A second-generation model is expected in the second half of 2027, with thinner designs, durability, and mass production capability as the next focus....
|
|
|
|
|
|
|
|
|
|
|
|
Börsentreff auf Facebook |
Börsentreff auf X |
Börsentreff auf Instagram
