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Amtech Systems Inc. is a global manufacturer of capital equipment, consumables, and related services for semiconductor device fabrication, packaging, and advanced substrate processing. The company operates through two primary segments: Thermal Processing Solutions, which provides reflow ovens, diffusion furnaces, and high-temperature conveyorized furnaces used in chip packaging, electronic assembly, and production of ceramic-based power semiconductor packages and passive components; and Semiconductor Fabrication Solutions, which offers consumables, equipment, and services for wafer polishing, cleaning, slicing, dicing, lapping, etching, and chemical mechanical planarization (CMP). Its products support the fabrication of silicon carbide (SiC) and silicon power devices, GPUs for AI applications, advanced automotive electronics, optical, analog, and digital devices. Amtech Systems Inc. serves semiconductor device and module manufacturers, particularly in Asia, North America, and Europe, through wholly-owned subsidiaries operating under premier brand names such as BTU International, PR Hoffman, and Intersurface Dynamics. Founded in 1981 and headquartered in Tempe, Arizona, the company plays a key role in enabling advanced packaging technologies critical to AI infrastructure and power electronics markets.
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