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01.07.26 - 07:48
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Taiwan und Korruption - Xi spricht zu 105 Jahre KP China (DPA-AFX)
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PEKING (dpa-AFX) - Chinas Staats- und Parteichef Xi Jinping hat die Kommunistische Partei (KP) zum 105. Jahrestag ihrer Gründung zur Lösung der "Taiwan-Frage" und zum Kampf gegen Korruption aufgefordert. Die Partei werde die "taiwanischen Mitbürger" vereinen, ......
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30.06.26 - 21:15
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Here We Go Again: Taiwan Raids Super Micro In AI Chip Probe (ZeroHedge)
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Here We Go Again: Taiwan Raids Super Micro In AI Chip Probe
Taiwan has intensified its efforts to stop advanced AI hardware from reaching China, carrying out raids at the local offices of Super Micro Computer and several businesses connected to an investigation into the movement of servers equipped with NVIDIA chips, according to Bloomberg.
Investigators searched multiple business locations and the homes of six individuals as part of the inquiry. While prosecutors did not publicly identify those involved, a source familiar with the matter said Super Micro's Taiwan office was among the locations searched. The company said it is fully cooperating with investigators and emphasized that it works to safeguard its technology and ensure its products are sold in compliance with applicable laws. Shares fell about 8% following the announcement.
Bloomberg writes that the probe also reached Chief Telecom and Albatron Technology. Both companies acknowledged the searches, saying day-to-day operations were ...
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30.06.26 - 06:45
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World′s Largest Chipmaker, Taiwan Semi, Accelerates Local DRAM Supply Chain With Winbond Collaboration (ZeroHedge)
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World's Largest Chipmaker, Taiwan Semi, Accelerates Local DRAM Supply Chain With Winbond Collaboration
In a time of heightened scrutiny on the memory supply chain, overnight the world's largest chipmaker, Taiwan's TSMC, is reportedly building out a domestic DRAM supply chain in Taiwan amid a severe global memory shortage, bringing in Winbond as a partner, UDN reported.
TSMC and Winbond are collaborating on a localized DRAM supply chain using 3D wafer-on-wafer (WoW) stacking technology, where Winbond would supply DRAM memory wafers to be stacked with TSMC's logic wafers. The move is designed to keep critical memory production close to home while feeding the demand of AI hardware.
Key details:
The tech: WoW uses hybrid bonding to directly stack logic chips and memory wafers vertically, creating tens of thousands to millions of micro copper interconnects — shortening data transmission distance versus traditional packaging, with higher bandwidth, lower latency, and better power efficiency. I...
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