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18.09.26 - 04:06
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Resonac grows 300mm SiC crystal, marking a substrate milestone (Digitimes)
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Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable energy systems, data centers, and advanced computing. The achievement underscores the push for larger, higher-quality wafers that may improve efficiency, reliability, and manufacturing scale....
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12.09.26 - 00:06
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Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line (Digitimes)
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Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains traction, Resonac CTO for semiconductor materials Hidenori Abe told DIGITIMES that the company sees five major materials challenges: warpage, plating, coating, bonding, and polishing....
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18.05.26 - 06:36
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INTERVIEW: Resonac to Propel Advanced Chip R&D (Nippon)
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Silicon Valley, May 17 (Jiji Press)--Japanese chemicals maker Resonac Holdings Corp. will step up efforts to develop cutting-edge semiconductors at a newly opened joint research hub in Silicon Valley, Hidehito Takahashi, the company's CEO, said in a recent interview. Takahashi said Resonac will pursue new technologies "at a high revolution" at the research and development center set up in Ap......
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21.04.26 - 14:43
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Japan-U.S. Chip Consortium Opens Silicon Valley Base (Nippon)
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Silicon Valley, April 20 (Jiji Press)--A consortium of 12 Japanese and U.S. semiconductor-related companies held an opening ceremony for its development base in Silicon Valley on Monday. The consortium's Japanese members include Resonac Corp., a subsidiary of Resonac Holdings Corp., formerly Showa Denko K.K., Toppan Holdings Inc. and Towa Corp., and its U.S. members include 3M Co. The con......
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05.03.26 - 01:06
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Glass fiber shortage hits IC substrates, MGC follows Resonac with 30% CCL price hike (Digitimes)
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Demand from Nvidia and Apple has intensified shortages of high-end glass fiber cloth used in IC substrates, driving broad price increases for related materials and squeezing profit margins for copper clad laminate (CCL) suppliers. Japanese materials makers have recently taken the lead in raising prices, shifting rising costs downstream to customers and end markets....
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17.12.25 - 03:06
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Resonac CEO on Business Outlook (Bloomberg)
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Hidehito Takahashi, President and CEO of Resonac, discusses his outlook for demand and business growth for the Japanese semiconductor materials supplier, and says the company will seek to procure rare earths from Australia and Europe. He speaks with Annabelle Droulers and Avril Hong on "Bloomberg: The Asia Trade". (Source: Bloomberg)...
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04.09.25 - 09:06
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Resonac launches JOINT3 alliance to develop next-gen semiconductor tech (Digitimes)
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Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related firms. The alliance aims to expedite the development and commercialization of advanced semiconductor technologies within five years through a collaborative investment of JPY26 billion (US$175.22 million), representing Resonac's largest semiconductor technology partnership to date....
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