|
|
|
|
|
|
|
|
|
05.09.26 - 02:12
|
Taiwan semiconductor output targets NT$8 trillion (Digitimes)
|
|
|
As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions, Taiwan's semiconductor industry output could top NT$8 trillion (approx. US$252.6 billion) in 2026. Advanced equipment and materials, historically local industry weak points, are also making remarkable gains, with domestic equipment output projected to reach NT$270 billion (US$8.5 billion)....
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
03.09.26 - 09:06
|
AUO unit eyes TSMC ecosystem as merger benefits emerge (Digitimes)
|
|
|
AUO Group's AET Corporation (AET), formed in September 2025 through the merger of AUO Envirotech and AUO Digitech, is expanding across the semiconductor supply chain and has reportedly entered the ecosystem of Taiwan Semiconductor Manufacturing Company (TSMC). After the merger, AET's core operations turned profitable in 2025, and the company is targeting a full-year profit in 2026....
|
|
|
|
|
|
|
03.09.26 - 04:06
|
AI substrate shortages widen as Unimicron signals capacity support through 2029 (Digitimes)
|
|
|
Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public appearance at Semicon Taiwan 2026. Chien appeared alongside ASE Technology CEO Tien Wu, TSMC senior vice president and deputy co-chief operating officer Cliff Hou, MediaTek CEO Rick Tsai and Foxconn chairman Young Liu....
|
|
|
03.09.26 - 01:42
|
CPO material race widens as Taiwan eyes key role (Digitimes)
|
|
|
At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan Semiconductor Industry Association (TSIA) discussed the future of silicon photonics (SiPh). They said the industry's bottlenecks have shifted from materials to packaging precision, materials platform selection, and the manufacturing tools needed to support both....
|
|
|
|