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23.04.26 - 11:42
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Taiwan to Ease Limits on Active Funds′ Investments in TSMC (Bloomberg)
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Taiwan's financial regulator plans to ease the limit on how much funds can invest in a single stock, lifting an impediment that has prevented local money managers from taking full advantage of the surge in Taiwan Semiconductor Manufacturing Co.'s shares in recent years....
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23.04.26 - 11:24
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TSMC Aktie: Zahlen, die den Markt dominieren (Aktiencheck)
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München (www.aktiencheck.de) - TSMC Aktie: Zahlen, die den Markt dominieren
TSMC (ISIN: US8740391003, WKN: 909800, Ticker-Symbol: TSFA, NYSE-Symbol: TSM) liefert aktuell Zahlen, die selbst im wachstumsstarken Halbleitersektor herausragen, so die Bank Vontobel Europe AG.
Im ersten Quartal 2026 habe das Unternehmen rund 35,9 Milliarden US-Dollar Umsatz erzielt, ein Plus von über 35% gegenüber dem ersten Quartal des Vorjahres. [mehr]...
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23.04.26 - 09:42
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US & Iran in Hormuz Standoff, ASML′s New Gear ′Too Expensive′ for TSMC | Daybreak Europe 4/23/2026 (Bloomberg)
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Bloomberg Daybreak Europe is your essential morning viewing to stay ahead. Live from London, we set the agenda for your day, catching you up with overnight markets news from the US and Asia. And we'll tell you what matters for investors in Europe, giving you insight before trading begins.
On today's show, oil continues to move higher with the US and Iran locked in a battle for control of the Strait of Hormuz. The White House says it's still waiting for a new peace proposal from Iran, but has not set a deadline.
The world's biggest chipmaker TSMC says ASML's latest machines are too expensive, dealing a blow to Europe's most valuable company. ASML's most cutting-edge chipmaking machines cost upwards of €350 million ($410 million).
And, EU leaders meet in Cyprus to address the mounting pressures facing the bloc.
Today's guest: Negah Angha, King's College London, Visiting Fellow. (Source: Bloomberg)...
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23.04.26 - 05:06
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TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV (Digitimes)
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TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven demand, and long-term manufacturing diversification. Analysts say the dual strategy highlights how advanced packaging and tool selection are becoming just as strategically important as leading-edge wafer production in shaping the global semiconductor supply chain....
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23.04.26 - 02:18
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TSMC targets 2029 production for A13 and A12 as next AI chip nodes (Digitimes)
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At its North America Technology Symposium, TSMC showcased a range of innovations in advanced process technologies. Following the introduction of its A14 process in 2025, the company unveiled the next-generation A13 process, delivering a direct upgrade with a more streamlined, efficient design to meet the growing demand from next-generation AI, high-performance computing (HPC), and mobile applications....
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