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03.02.26 - 08:18
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AMD and Broadcom back Powertech′s FOPLP; monthly revenue to hit NT$3 billion (Digitimes)
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Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid ongoing memory shortages and rising demand for advanced packaging, Powertech aims to become the top partner outside the TSMC ecosystem, expecting a significant revenue surge in 2027-2028 as FOPLP capacity reaches full utilization, contributing NT$3 billion (US$95 million) monthly....
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03.02.26 - 01:06
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Taiwan′s top talent pivots to healthcare, eyeing TSMC-style success (Digitimes)
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TSMC leads the global semiconductor race with advanced processes and a market value of NT$46.5 trillion (US$1.47 trillion), placing itself at the core of what is commonly described as Taiwan's "silicon shield." Inspired by this success, Taiwan's top talent is now turning to the medical field, aiming to replicate TSMC's path by developing a biotech- and healthcare-centered "shield" that could become another national pillar....
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03.02.26 - 01:06
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Alchip, GUC, and Faraday eye 2026 growth on US CSP chip orders (Digitimes)
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Alchip, Global Unichip (GUC), and Faraday each hold unique strengths as leading ASIC design service providers. Benefiting from major US cloud service providers' (CSPs) push for in-house chip development, their long-term operations are highly anticipated. Among them, Alchip focuses on high-end AI and sub-5nm advanced processes for US customers; GUC primarily serves TSMC-related projects; while Faraday targets mature to advanced process nodes in artificial intelligence of things (AIoT) and industrial control sectors....
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02.02.26 - 15:12
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Broadcom and TSMC Emerge as ‘Big Winners’ in Custom AI Chip Boom (24/7 Wall St.)
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Broadcom (NASDAQ:AVGO) and Taiwan Semiconductor Manufacturing (NYSE:TSM) are emerging as major beneficiaries of the custom AI chip boom, capturing value alongside NVIDIA's continued dominance in the AI infrastructure market. Broadcom just reported Q1 FY2026 revenue of $18.02B, up 28% year-over-year, with AI semiconductor revenue surging 74%. The company's Q1 FY2026 guidance projects AI semiconductor revenue ... Broadcom and TSMC Emerge as 'Big Winners' in Custom AI Chip Boom
The post Broadcom and TSMC Emerge as 'Big Winners' in Custom AI Chip Boom appeared first on 24/7 Wall St.....
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02.02.26 - 10:06
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SMIC reportedly sets up advanced packaging research institute in Shanghai (Digitimes)
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As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with SMIC chairman Liu Xunfeng attending the unveiling ceremony, marking a new stage in the company's advanced packaging research and development efforts....
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01.02.26 - 12:06
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Nvidia′s Jensen Huang urges TSMC to expand capacity amid AI chip crunch (SCMP)
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Taiwan Semiconductor Manufacturing Company (TSMC) needs to “work very hard” to meet growing demand from leading US chip designer Nvidia, which alone could require TSMC to more than double its capacity in the next decade, Nvidia CEO Jensen Huang has said.
Huang's remarks followed a high-profile banquet on Saturday evening with executives of key supply chain partners in Taiwan, including TSMC chairman and CEO C C Wei and Foxconn chairman Young Liu, as the Nvidia founder sought to shore up supply......
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