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04.01.26 - 07:42
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Analysis: Japan targets advanced packaging to crack TSMC′s manufacturing edge (Digitimes)
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Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and 2nm capacity is largely locked in. Advanced packaging now contributes a growing share of sales. The company is on track to see annual revenue exceed US$250 billion around 2029 or 2030. That widening gap has pushed Japanese companies to focus on panel-level packaging and nanoimprint technologies. Both emerged at SEMICON Japan 2025 as key levers to bypass manufacturing bottlenecks and secure a foothold in the fast-expanding AI accelerator supply chain....
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02.01.26 - 05:36
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US approval of TSMC equipment exports to China reflects strategy shift (Digitimes)
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Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved TSMC to export chip manufacturing equipment containing US technology to its wafer fabs in Nanjing and other locations in China over the next year. The approval ensures existing production lines can continue operating normally and meet product delivery schedules....
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02.01.26 - 04:06
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China demand pushes Nvidia to seek more H200 capacity from TSMC (Digitimes)
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Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters. The negotiations signal that Chinese demand continues to strain global supply chains even as the company faces a complex and unresolved regulatory environment in both Washington and Beijing....
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02.01.26 - 03:06
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Intel and Samsung advance 2nm GAA, but yield gaps leave TSMC as the sole external supplier (Digitimes)
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TSMC has officially commenced volume production of its 2nm (N2) semiconductor process in the fourth quarter of 2025, marking a milestone as the first foundry worldwide to offer chiplet manufacturing based on nanosheet transistor technology using gate-all-around (GAA) architecture. Production is ramping up at TSMC's Hsinchu Baoshan fab (Fab 20) and Kaohsiung fab (Fab 22), positioning the company to meet growing market demand into 2026....
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02.01.26 - 02:15
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US Grants TSMC Full-yr License to Export US Chipmaking Tools to CN (AAStocks)
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The US government has granted TSMC (TSM.US) a full-year license to export US chip manufacturing equipment to its factories located in Nanjing, China. This move is expected to ensure the plant operations and product deliveries will not be interrupted.TSMC's Nanjing factory produces 16-nanometer and other chips, excluding TSMC......
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01.01.26 - 07:12
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US grants TSMC annual licence to import American chipmaking tools into China (SCMP)
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The US government has granted an annual licence to Taiwan Semiconductor Manufacturing Co (TSMC) to import American chip manufacturing equipment to its fabrication facilities in Nanjing, the capital of eastern China's Jiangsu province, according to the company.
The approval “ensures uninterrupted fab operations and product deliveries”, TSMC, the world's largest contract chipmaker, said in a statement on Thursday to Reuters.
South Korea's Samsung Electronics and SK Hynix have also received......
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