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24.04.26 - 11:06
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M31 and TSMC complete eUSB2V2 tapeout on N2P process (Digitimes)
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IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the manufacturing platform to boost design efficiency and accelerate time-to-market....
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24.04.26 - 10:06
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TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker (Digitimes)
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The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding's equipment orders may also be affected as the supply chain undergoes potential realignment....
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23.04.26 - 11:42
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Taiwan to Ease Limits on Active Funds′ Investments in TSMC (Bloomberg)
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Taiwan's financial regulator plans to ease the limit on how much funds can invest in a single stock, lifting an impediment that has prevented local money managers from taking full advantage of the surge in Taiwan Semiconductor Manufacturing Co.'s shares in recent years....
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