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17.12.25 - 10:06
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Rapidus unveils glass interposer to challenge TSMC (Digitimes)
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Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs and strengthen its challenge to industry leader TSMC as Japan pushes to rebuild its advanced semiconductor base....
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17.12.25 - 08:06
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Monthly Update - November 2025 (Cision)
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17 December 2025
Ashoka WhiteOak Emerging Markets Trust plc
(the 'Company')
Monthly Update – November 2025
The Company's monthly factsheet as at 30 November 2025 is now available: https://awemtrust.com/factsheet/
The Fund was down 2.41% in November 2025, outperforming the benchmark by 0.80%. The key contributors include Sudeep Pharma (+30.3%), Vivara Participacoes (+12.5%), and Aura Minerals (+24.7%), whereas TSMC (-6.8%), Samsung Electronics (-10.2%), and Alibaba Group Holding (-9.2%) were the key detractors.
Market Review
In November 2025,...
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17.12.25 - 05:12
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Moore′s Law of Economy: Former TSMC exec warns semiconductor talent gap could widen 15-fold (Digitimes)
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Burn-Jeng Lin, one of TSMC's six R&D pioneers and current dean of National Tsing Hua University's College of Semiconductor Research, introduced the concept of a "Moore's Law of Economy" on December 16, 2025. He emphasized that innovation can still overcome the physical limits of chip size reduction, but warned that global semiconductor talent shortages may expand 15-fold as countries race to build complete supply chains....
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15.12.25 - 04:06
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TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises (Digitimes)
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As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers has emerged. To address the strong demand for advanced packaging capacity from AI GPU and ASIC vendors, and as IC design houses increasingly introduce second suppliers to enhance supply chain resilience, TSMC is expected to begin expanding the release of Chip-on-Wafer (CoW) packaging process orders to OSAT providers starting in 2026-2027....
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15.12.25 - 00:06
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Samsung pushes new thermal packaging to win back Qualcomm and Apple (Digitimes)
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Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market share from TSMC. The South Korean company plans to offer its Heat Path Block solution to third-party chip designers after validating the system in its upcoming Exynos 2600 processor, according to local media reports....
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