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22.12.25 - 00:54
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Column: 2D materials struggle to deliver on semiconductor scaling promise (Digitimes)
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The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal dichalcogenides (TMDs) have since enabled progress in niche applications and research prototypes. Yet their impact on mainstream logic devices remains limited. The long-anticipated use of 2D materials to sustain Moore's Law through transistor channel integration has yet to materialize at scale....
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20.11.25 - 08:01
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Silicon Box CEO on Semiconductor Industry Innovation (Bloomberg)
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Silicon Box is a Singapore-based semiconductor company focused on chiplets and advanced packaging at panel-scale technology. It works with customers and partners that include some of the world's largest advanced chip companies. CEO Byung Joon Han discusses their business and outlook on AI demand with Shery Ahn and Avril Hong on the sidelines of the Bloomberg New Economy Forum 2025 in Singapore. (Source: Bloomberg)...
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19.11.25 - 05:06
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Nan Pao Resins bets on semiconductor adhesives as next major growth engine (Digitimes)
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Taiwan's Nan Pao Resins Chemical expects semiconductor adhesives to become a major growth driver and has elevated the segment to a top strategic priority. This shift follows the establishment of a new joint venture in August 2025 with Advanced Echem Materials (AEMC) and Trusval Technology, aimed at expanding into advanced adhesive materials for semiconductor packaging....
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18.11.25 - 04:06
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Samsung′s glass substrate samples fall short of requirements (Digitimes)
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Samsung Electronics has been in active discussions with Samsung Electro-Mechanics (Semco), Japan's Ibiden, and Shinko Electric Industries regarding collaboration on semiconductor glass substrates. However, reports indicate that they have not yet advanced to formal sample evaluation because of Samsung's assessment of the technology and market potential of glass substrates....
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