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19.04.26 - 01:06
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ASE′s CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries (Digitimes)
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AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers to large-size panels. Semiconductor equipment leader Skytech's CEO George Yi announced that its self-developed 310x310mm panel-level packaging physical vapor deposition (PLP PVD) system, a world first, has completed delivery and been successfully integrated into production lines at major OSAT firms including ASE Technology Holding....
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12.03.26 - 05:06
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ASE′s Tien Wu: Taiwan leverages hardware strength as US chip rivalry intensifies (Digitimes)
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Given the global chip war and US-China rivalry, ASE Technology Holding COO Tien Wu says that in an era where AI is driving transformation in the technology industry, the new bottleneck in hardware is now in Taiwan's hands. Taiwan should use this as leverage rather than as a tool to monopolize the semiconductor industry, allowing it to pursue mutually beneficial coexistence with supply chain partners and customers while maintaining a leading position in the global AI race....
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11.02.26 - 07:06
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ASE focuses on Malaysia expansion, ADI plant acquisition expected to close in 2Q26 (Digitimes)
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After US President Donald Trump took office, he vigorously promoted the reshoring of the chip manufacturing supply chain, prompting some Taiwanese companies to shift the focus of their overseas expansion from previously favored new hubs in Southeast Asia to Arizona, where TSMC is located. Dr. Tien Wu, chief operating officer of ASE Technology Holding, said that the group's future overseas manufacturing footprint will still center on Penang, Malaysia, with the Philippines and South Korea serving as complementary bases, targeting automotive and robotics orders from global IDM customers....
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