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20.10.26 - 10:06
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AUO selects glass substrate specs for semiconductor processes, not size rivalry (Digitimes)
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AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman and CEO Paul Peng. The company aims to leverage its glass-processing expertise to supply critical components and technologies to outsourced semiconductor assembly and test (OSAT) leaders such as ASE Technology Holding and Powertech Technology....
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01.10.26 - 04:06
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AI chip packaging demand meets labor pushback: ASE′s NT$5.6B Taiwan snack factory deal sparks strike vote (Digitimes)
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ASE Technology Holding (ASEH) announced on July 30 that it would spend roughly NT$5.67 billion (approx. US$177.97 million) to acquire land and factory buildings in the Zhongli Industrial Park from Taiwanese snack maker Kuai Kuai, a move meant to support future capacity expansion at its Zhongli plant. The deal, however, has unexpectedly become a flashpoint, with the Kuai Kuai union recently holding a strike vote and protesting outside ASE's Zhongli facility....
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16.09.26 - 21:06
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Charts: Taiwan′s chip packaging growth runs deeper than ASE (Digitimes)
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Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked by DIGITIMES posted combined January-August 2026 revenue of NT$768.9 billion (approx. US$24.1 billion), up 27.1% from a year earlier. Without ASE Technology Holding, the rest of the group still grew 25.4%....
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