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31.08.26 - 04:06
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Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6 (Digitimes)
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Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and Apple, Qualcomm, MediaTek and Taiwan suppliers advancing new AI and 2nm strategies. Below are the most-read DIGITIMES stories from the week of August 24-30, 2026....
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29.08.26 - 00:48
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Qualcomm′s HBC play pulls Samsung and SK hynix into a new race beyond HBM (Digitimes)
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The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes, context windows and inference workloads continue to expand, the bottleneck is increasingly shifting from how much memory can be stacked toward how efficiently data can move between memory and compute....
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