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03.11.26 - 05:06
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AI demand, resin shock stretch India PCB shortage into 2027 (Digitimes)
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The printed circuit board (PCB) shortage that Indian electronics makers expect to worsen in the coming months is part of a global squeeze. AI servers are absorbing high-end laminate, glass fiber cloth, and Ajinomoto Build-up Film (ABF) capacity; the war in West Asia has cut off a key resin; and equipment for new capacity can take up to 30 months to deliver. Supply chain estimates cited in Taiwan suggest the tightest materials will ease only gradually, from the second half of 2027 through 2028....
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14.08.26 - 01:06
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ABF substrate boom lifts Eternal Precision prices 20% (Digitimes)
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Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision Mechanics, a unit of Eternal Materials, saying customer orders and inquiries jumped sharply around Christmas 2025 and have continued since. Its Japan plant has been running at full capacity since May this year....
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09.08.26 - 01:24
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Ajinomoto rides advanced packaging boom as ABF demand surges (Digitimes)
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Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of electronic materials used in semiconductor package substrates, highlighting how advanced packaging is shifting more value upstream into specialized materials....
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06.08.26 - 13:24
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Ajinomoto Lifts Annual Guidance (AFX)
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TOKYO (dpa-AFX) - Ajinomoto Co., Inc. (AJINF, 2802.T), a Japanese food and biotechnology company, on Thursday revised up its annual outlook.For the 12-month period to March 31, 2027 (the full year......
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06.08.26 - 02:12
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FOPLP leads production as CoPoS advances glass packaging (Digitimes)
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AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF) substrates and silicon interposers are increasingly hitting bottlenecks in cost, warpage, and packaging efficiency, making glass substrates and glass interposers a key focus in next-generation advanced packaging plans....
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