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04.06.26 - 01:18
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Interview: Andhra Pradesh moves to become India′s semiconductor packaging hub (Digitimes)
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Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of the Computex technology expo in Taipei, Bhaskar Katamneni, Secretary to the Government for ITE&C, acknowledged that wafer fabrication remains a long-term "seven or eight-year journey," but said packaging work is already well underway — with four PCB manufacturers having already begun operations, according to him....
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04.06.26 - 01:18
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BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek (Digitimes)
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Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed by orders and funding from AMD and MediaTek, the company is using a lean-asset model and ecosystem integration strategy to push into full-optical CPO design. General manager Jada Wang said 2026–2027 will mark the industry-wide breakout point for SiPh chips and CPO commercialization. BE Epitaxy Semiconductor's 800G products have already reached shipment standards, and the company is now moving toward 1.6T optical engine (OE) chipsets....
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