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09.09.26 - 11:06
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Jin Lian Cheng expands into semiconductor wafer fab UPS battery recycling (Digitimes)
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Jin Lian Cheng Resources completed an upgrade to its desulfurization production line as demand increased for lead-acid battery recycling tied to high-spec uninterruptible power supply (UPS) systems used by semiconductor plants. The Taiwanese waste lead-acid battery processor said the upgrade restored normal operations while improving sulfur oxide treatment, real-time monitoring, and environmental management....
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07.09.26 - 01:54
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Experts say subsidies can′t buy semiconductor competitiveness (Digitimes)
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At a forum jointly hosted by DSET and SEMI during SEMICON Taiwan this year, Glenn D. Tiffert of the Hoover Institution, Kioxia Holdings board member Emiko Higashi, and NRC reporter Marc Hijink offered views on national semiconductor policy from the perspectives of the US policy community, corporate boardrooms, and Europe's industrial front line....
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07.09.26 - 01:54
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BenQ Materials targets CPO in semiconductor push (Digitimes)
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BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move into wafer manufacturing, back-end packaging, and co-packaged optics (CPO). With chemical mechanical planarization (CMP) cleaning brush rollers and wafer dicing tape already shipping, the group views 2026 as a new starting point for its semiconductor business, with more visible growth expected from 2027....
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06.09.26 - 00:06
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Tongtai doubles semiconductor orders on AI data-center demand (Digitimes)
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Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent years. The group is extending its traditional machine tool expertise into hard and brittle material processing, advanced packaging, and smart manufacturing production-line solutions required for semiconductor fabrication....
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05.09.26 - 19:06
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Trumpf CTO says advanced packaging reshapes semiconductor equipment race (Digitimes)
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AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data transfer requirements rise rapidly, competition is no longer limited to front-end process scaling; 3D stacking, advanced packaging, high-density interconnects, thermal management, and memory technologies are also becoming more important....
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05.09.26 - 02:12
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Taiwan semiconductor output targets NT$8 trillion (Digitimes)
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As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions, Taiwan's semiconductor industry output could top NT$8 trillion (approx. US$252.6 billion) in 2026. Advanced equipment and materials, historically local industry weak points, are also making remarkable gains, with domestic equipment output projected to reach NT$270 billion (US$8.5 billion)....
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