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06.09.26 - 00:06
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Tongtai doubles semiconductor orders on AI data-center demand (Digitimes)
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Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent years. The group is extending its traditional machine tool expertise into hard and brittle material processing, advanced packaging, and smart manufacturing production-line solutions required for semiconductor fabrication....
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05.09.26 - 19:06
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Trumpf CTO says advanced packaging reshapes semiconductor equipment race (Digitimes)
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AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data transfer requirements rise rapidly, competition is no longer limited to front-end process scaling; 3D stacking, advanced packaging, high-density interconnects, thermal management, and memory technologies are also becoming more important....
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05.09.26 - 02:12
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Taiwan semiconductor output targets NT$8 trillion (Digitimes)
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As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions, Taiwan's semiconductor industry output could top NT$8 trillion (approx. US$252.6 billion) in 2026. Advanced equipment and materials, historically local industry weak points, are also making remarkable gains, with domestic equipment output projected to reach NT$270 billion (US$8.5 billion)....
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04.09.26 - 06:06
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Kyocera completes Nagasaki plant for semiconductor ceramics and packages (Digitimes)
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Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor its push into semiconductor-related products. Total investment will reach approximately JPY68 billion (US$424.70 million) by the end of March 2029, according to the company's announcement....
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03.09.26 - 05:06
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Solomon leverages AI vision and optical tech to tap semiconductor inspection market (Digitimes)
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Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies at Semicon Taiwan 2026. The applications include full-wafer warpage detection inside front-opening unified pods (FOUP)/cassettes and through-glass via (TGV) aperture defect inspection technology, aimed at preventing equipment downtime during manufacturing processes and ensuring the yield and quality of next-generation advanced packaging....
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03.09.26 - 04:06
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Win Semiconductors unveils 0.1μm GaN for AI, satellite links (Digitimes)
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Taiwanese compound semiconductor maker WIN Semiconductors said on September 1, 2026, that compound semiconductors are the backbone of AI and satellite communications, as it unveiled 0.1μm GaN technology aimed at higher-speed transmission. Senior associate vice president Chuck Huang made the remarks at the NExT Forum....
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