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29.05.26 - 08:06
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From cloud to factory floor: KETI outlines four directions shaping next-gen physical AI chips (Digitimes)
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As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed at supporting industrial "physical AI."...
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29.05.26 - 04:06
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Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips (Digitimes)
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Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware....
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