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02.09.26 - 11:30
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China′s No 2 foundry Hua Hong invests US$2b in new fab to meet surging AI-driven demand (SCMP)
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Major Chinese foundry Hua Hong Grace Semiconductor is pouring US$2 billion into a massive capacity expansion in the Chinese chip production hub of Wuxi, racing to meet skyrocketing domestic demand for AI infrastructure and bypass US tech curbs.
The fresh capital would fund the construction of a new 12-inch speciality line, its third facility in the eastern Chinese city, the country's second-largest contract chipmaker said in a filing to the Hong Kong stock exchange on Tuesday.
Once fully......
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02.09.26 - 11:30
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Deloitte richtet KI-Beratung neu aus (Finance Magazin)
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Kathrin Schwan wird bei Deloitte Partnerin und Chief Data & Analytics Officer. Das Big-Four-Haus schafft die Rolle neu – und läutet damit einen Strategiewechsel ein. An anderer Stelle gibt es dafür einen Weggang....
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02.09.26 - 11:18
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China cracks down on AI deepfakes and clickbait cluttering WeChat, RedNote, Douyin (SCMP)
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China is cracking down on artificial intelligence-generated “slop” – low-grade, mass-produced synthetic content cluttering social media and news feeds – as part of a sweeping campaign against generative technology abuse, the country's top internet watchdog said on Wednesday.
In a statement posted to its website, the Cyberspace Administration of China (CAC) said it had scrubbed more than 5.61 million pieces of harmful or illegal content and removed some 49,000 accounts during its latest......
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02.09.26 - 11:06
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Indium CEO: packaging, cooling and power are next AI bottlenecks (Digitimes)
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As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and power delivery. With GPUs, high-bandwidth memory (HBM), and advanced packaging pushing power density higher, chipmakers now face challenges that extend well beyond silicon manufacturing, including managing thermal expansion, warpage, heat dissipation, and reliability across heterogeneously integrated materials....
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