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21.07.26 - 03:06
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Microsoft promotes AI sovereignty through local data, while Stanford warns on US jurisdiction (Digitimes)
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Microsoft has been positioning AI sovereignty as a way to prioritize local languages, culture and values in AI systems rather than build isolated national alternatives, according to remarks from its Responsible AI leadership at the AI for Good summit. The discussion comes as enterprise and government buyers weigh how much control they can retain over data and model access when relying on major US cloud providers....
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21.07.26 - 02:00
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AI boom may reshape SK Siltron sale as chairman reportedly rethinks (Digitimes)
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SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about whether the asset should be sold at all. While SK originally pushed the sale to improve rebalancing and its financial structure, many inside and outside the group now see securing a stable wafer supply chain as the higher strategic priority....
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21.07.26 - 02:00
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AI-related power management needs drive e-Fuse demand for Fortune Advanced Technology (Digitimes)
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Power management IC (PMIC) maker Fortune Advanced Technology is set to list on the Emerging Stock Board on July 22, with an eye on growing demand for high-voltage power management in AI data centers driving the need for e-fuses and smart power management solutions. In addition, shipments of higher-margin products are also lifting revenue for the company, as it seeks opportunities in importing substitute protective components....
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21.07.26 - 02:00
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TSMC sees structural AI growth, expands Arizona capex (Digitimes)
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TSMC Chief Financial Officer Wendell Huang said the company expects AI chip demand to remain strong for years, prompting it to keep expanding investment in its Arizona site. After previously announcing an additional US$100 billion investment, TSMC has raised its total planned investment there to US$265 billion....
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21.07.26 - 02:00
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Elite Material, TUC race ahead in AI CCL push (Digitimes)
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As AI server products accelerate their generational shift and demand higher-frequency, higher-speed transmission, the upgrade cycle for copper-clad laminate (CCL) materials in the PCB upstream supply chain has become firmly established. M7 and M8 specs are now mainstream, while M9 and M10 materials remain in the testing and validation stage, with mass production expected in 2027 or 2028....
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