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19.10.26 - 06:36
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Anthropic opens Singapore office, signs AI cooperation agreement (Digitimes)
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Anthropic has opened its fifth Asia-Pacific office in Singapore and signed a memorandum of understanding with the city-state's digital ministry, broadening cooperation on AI safety, security, evaluation, and adoption. The move expands the company's presence in a market where Claude use is among the highest in the world, with implications for governance....
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19.10.26 - 06:24
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EU plant KI-Revolution: Viele offene Fragen (DW)
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Im KI-Wettlauf sind die USA und China weit vorne. Die Europäische Union will ihre Wirtschaft mithilfe von KI ankurbeln. Doch wichtige Aspekte wie Arbeitnehmerschutz sowie Sicherheit und Klimaschutz sind ungeklärt....
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19.10.26 - 06:06
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The UK Shows How AI Could Affect Jobs (Bloomberg)
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The UK is at the sharp end of transformations in the age of AI because finance, one of the industries most exposed to disruption, is also one of the UK's biggest employers and most important exports. Bloomberg Opinion columnist Paul J. Davies explains why other nations should watch closely. (Source: Bloomberg)...
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19.10.26 - 06:06
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Shipments of high-end cloud AI accelerators, 2027 (Digitimes)
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DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year....
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19.10.26 - 06:06
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Lens Technology enters AI server cooling market with US$25 million PMG takeover (Digitimes)
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China's precision manufacturing giant Lens Technology is expanding into AI server infrastructure through a proposed US$25 million acquisition of a controlling stake in PMG International, gaining access to server rack manufacturing and liquid-cooling technologies. The transaction marks a further diversification beyond the company's established consumer electronics and automotive components businesses....
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19.10.26 - 05:06
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Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup (Digitimes)
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South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, scheduled for launch in 2027. The company also introduced five 2.5D packaging systems designed to accommodate increasingly large AI chip packages....
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19.10.26 - 05:06
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TSMC′s only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D (Digitimes)
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South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development and strengthen its advanced process and packaging capabilities through its Taiwan R&D center. Memory controller projects remain its primary revenue source, supporting its expansion into AI chip mass production and overseas markets....
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19.10.26 - 05:06
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AUO expands AI businesses as it seeks its next growth curve (Digitimes)
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AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor packaging. The display maker has secured board approval for NT$24 billion (US$739.92 million) in planned investment for 2026, as chairman and CEO Paul Peng positions the initiatives as a route to growth and supply-chain relevance....
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19.10.26 - 05:06
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Micron develops robot memory as Samsung, SK Hynix target physical AI (Digitimes)
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Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating within battery power limits. The companies are pursuing both memory designs and storage products for robots and autonomous vehicles....
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19.10.26 - 05:06
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iBase Solution targets AI data center EPC contracts with modular liquid cooling, energy storage expertise (Digitimes)
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Taiwan-based iBase Solution is expanding from industrial computers (IPCs) and energy storage into liquid-cooled prefabricated modular data centers, targeting AI infrastructure construction and engineering, procurement, and construction (EPC) contracts. The company aims to leverage its energy storage expertise, system integration capabilities, and customer relationships to capture opportunities in power, cooling, and data center development as global AI investment grows....
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