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05.03.26 - 04:06
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Broadcom-TSMC 3.5D AI chips give ASIC leader an early edge over Nvidia (Digitimes)
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In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it was working with TSMC to launch its 3.5D eXtreme Dimension System in Package (XDSiP) platform, with products scheduled to ship in 2026. Broadcom has now confirmed that the product, built on a 2nm process and using 3.5D system-level packaging, has begun shipping on schedule, primarily to customer Fujitsu....
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05.03.26 - 03:06
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Broadcom says Tomahawk switches are driving market share as AI networking demand accelerates (Digitimes)
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On March 4, Broadcom told investors its Tomahawk family is a key competitive advantage as customers build larger AI clusters. Management highlighted Tomahawk 6 — which it described as the industry's only 100-terabit-per-second switch introduced in the last year — as a first-to-market product that hyperscalers are adopting for high-bandwidth cluster interconnects. The company said that the combination of switching performance and early availability has helped it "capture demand from hyperscalers" regardless of whether those customers run XPUs or GPUs....
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05.03.26 - 02:12
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Broadcom targets $100bn AI chip revenue by 2027 as hyperscaler demand scales (Digitimes)
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On March 4, Broadcom told investors on its fiscal first quarter 2026 earnings call that its projection of “significantly in excess of US$100 billion” in 2027 refers specifically to silicon content — chips such as custom XPUs, switch chips, and DSPs — rather than broader systems, services, or software. CEO Hock E. Tan said management has “line of sight” to that chip-only figure and repeatedly framed the outlook around per‑customer compute deployments rather than one‑off transactions....
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05.03.26 - 02:06
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Broadcom says five AI chip partners are ramping, OpenAI slated for 2027 (Digitimes)
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Broadcom on Monday detailed progress across its custom AI XPU roadmap, saying deployments with five major customers are advancing and that a sixth — OpenAI — is set to begin volume XPU use in 2027. Management framed the programs as deep, multi‑year partnerships tied to large gigawatt‑scale capacity plans and said Broadcom has secured the supply chain to support the ramps through 2028....
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05.03.26 - 01:30
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Goldman′s Solomon on Iran, AI and Private Credit (Bloomberg)
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Goldman Sachs Chair and CEO David Solomon discusses the market reaction to the Iran attacks, his views on AI and why he is keeping an eye on the private credit market. He speaks with Haidi Stroud-Watts on "Bloomberg: The Asia Trade." (Source: Bloomberg)...
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