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09.11.26 - 04:13
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UBS′ Peirce on AI Buildout, Dealmaking Landscape (Bloomberg)
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Greg Peirce, Co-Head of Global Banking for APAC at UBS and also Co-Country Head at UBS Australia, discusses the outlook for the the artificial intelligence infrastructure buildout and the landscape for dealmaking. He speaks with Haidi Stroud-Watts on the sidelines of the UBS Australasia Conference in Sydney. (Source: Bloomberg)...
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09.11.26 - 04:06
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MediaTek, Qualcomm shift focus to cloud AI as smartphones stall (Digitimes)
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Qualcomm and MediaTek, the two leading smartphone SoC makers, are turning their attention to cloud AI ASICs as the global smartphone market faces what could be its sharpest decline on record in 2026. At their latest earnings briefings, cloud AI dominated the discussion, while smartphone operations took a back seat....
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09.11.26 - 04:06
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Inside the Siri overhaul: Apple′s performance in the AI race (Digitimes)
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Apple has reached a pivotal juncture in its artificial intelligence (AI) strategy: to modernize Siri and establish a broader AI presence. While new CEO John Ternus has publicly championed the company's privacy-centric, deeply integrated approach to AI, internal pressures highlight an urgent drive to accelerate innovation and close the gap with industry rivals....
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09.11.26 - 03:06
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Weekly news roundup: AI compute race intensifies as DRAM rivals diverge and chipmakers expand investments (Digitimes)
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This week's coverage highlights accelerating competition across AI infrastructure, semiconductor manufacturing and advanced memory. Sweden launched the NVIDIA-based Sferical One supercomputer as leaders urged transformational AI adoption. DRAM makers remain divided over 4F-squared scaling, while CXMT reported sharply higher revenue and outlined 2027 growth plans. Panasonic's Taiwan plant suffered a fatality-risking explosion, Musk may reconsider Terafab control, SK Hynix expanded its AI investment portfolio, and MediaTek hired former Intel packaging chief Navid Shahriari....
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09.11.26 - 03:06
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Nittobo′s T-Glass supply crunch deepens despite 3.6-fold capacity expansion plan for AI chips (Digitimes)
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Japan's Nittobo (Nitto Boseki) plans to invest an additional JPY20 billion (approx. US$127 million) to expand production of T-Glass, a specialized low-coefficient-of-thermal-expansion (low-CTE) glass fiber cloth used in advanced semiconductor packaging. The expansion will increase capacity to 3.6 times its fiscal 2025 level by fiscal 2029, reflecting persistent supply shortages and growing demand from AI chipmakers....
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09.11.26 - 03:06
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Adata revenue to dip slightly in 4Q26 as AI investment shifts overseas (Digitimes)
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Memory module maker Adata reported October 2026 consolidated revenue of NT$17.06 billion (US$521.6 million), up 8.5% month-over-month and 282.3% year-over-year, marking its third-highest monthly revenue on record. However, year-end customer inventory adjustments are expected to push fourth-quarter revenue below the third quarter, while revenue for the first 10 months of 2026 reached NT$134.37 billion, up 222.7% year-over-year. Adata expects its full-year 2026 operating performance to continue climbing....
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09.11.26 - 03:06
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IC test-interface supplier WinWay hits AI, HPC record in 3Q26 (Digitimes)
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WinWay reported record revenue and profit for the third quarter of 2026, driven by fully booked AI and high-performance computing (HPC) orders and expanded production capacity. The semiconductor test-interface supplier said shipments reached a new high, pushing cumulative revenue for the first three quarters of 2026 above NT$10 billion (US$305.4 million) and marking six consecutive quarters of record revenue....
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09.11.26 - 03:06
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Elan Microelectronics pursues dual-track PC strategy as AI, ADAS, drone lines ramp up (Digitimes)
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Elan Microelectronics posted Q3 2026 revenue of NT$2.22 billion (approx. US$67.8 million), down 30.7% quarter-over-quarter and 33.1% year-over-year due to a weak PC peak season. Gross margin fell 2.7 percentage points quarter-over-quarter to 44.7%, while operating profit dropped 57.5% quarter-over-quarter to NT$296 million (US$9.1 million). The slump stemmed from H1 order pull-forwards, client inventory digestion, supply mismatches, and rising module costs with passive components, PCBs, and packaging. Touch products contributed 73% of revenue, non-touch 13%, and emerging AI lines 14%....
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09.11.26 - 03:06
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ECS sees 4Q26 shipments plunging 56%, targets edge AI (Digitimes)
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Weak PC demand, customer order adjustments, product transitions, and component supply changes are sharply weakening Elitegroup Computer Systems' (ECS) 2026 OEM and channel shipment outlook. Supply-chain sources estimate the company's related shipments at about 1.92 million units for 2026, down 43% from 3.38 million units in 2025, with fourth-quarter shipments expected to fall 55.9% year-over-year....
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09.11.26 - 03:06
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Sino-American Silicon Products posts record revenue in first three quarters of 2026 on AI, energy demand (Digitimes)
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Sino-American Silicon Products (SAS) is focusing on computing power and electricity, as construction of artificial intelligence (AI) data centers accelerates, demand for high-bandwidth memory (HBM) surges, and the global energy transition continues to advance. By leveraging its dual-track strategy of manufacturing and services, the company is capitalizing on market opportunities, driving consolidated revenue for the first three quarters of 2026 to a record high for the same period....
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