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18.03.26 - 06:06
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GTC 2026: Nvidia charts optical-copper path (Digitimes)
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At GTC 2026, Nvidia outlined a dual-track approach combining copper cables and silicon photonics (SiPh) to meet surging AI-driven demand for data center interconnects. CEO Jensen Huang emphasized that as AI compute needs escalate, future data centers will require expanded capacity across copper cabling, optical communication, and co-packaged optics (CPO) — establishing optical-copper parallelism as the industry's defining development path....
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16.03.26 - 06:06
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GEM Services upgrades copper clip bonding for AI server dual-sided cooling (Digitimes)
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Taiwan-based power semiconductor packaging and testing firm GEM Services has announced advancements in its copper clip bonding technology to meet growing demand for enhanced cooling solutions in AI servers. As AI servers increase in power density, effective heat dissipation becomes critical, prompting a shift from traditional bottom cooling designs to top and dual-sided cooling products....
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