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22.09.26 - 10:12
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Ceer, Saudi-Arabiens neue E-Auto-Marke, zeigt erstes Modell (Electrive)
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Die saudische E-Auto-Marke Ceer, ein Joint Venture zwischen Foxconn und dem saudi-arabischen Staatsfonds PIF, hat ihr erstes Modell präsentiert. Exobot ist das Flaggschiffmodell von Ceer und wird in zwei Karosserievarianten erhältlich sein – als E-Limousine und als E-SUV....
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22.09.26 - 06:06
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TSMC anchors Kaohsiung′s Baipu Park as ASE expansion spurs phase-two development (Digitimes)
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Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park in Kaohsiung, where construction has formally begun on what is billed as Taiwan's first advanced packaging supply-chain cluster. Led by TSMC, the park's first phase has already been fully allocated, and a groundbreaking ceremony on September 21 drew more than 20 semiconductor companies, including TSMC, Foxconn, and ASE....
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21.09.26 - 04:31
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Foxconn takes EV ambitions deeper with Quantron commercial vehicle deal (Digitimes)
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Foxconn is expanding its global electric vehicle footprint through partnerships with German commercial vehicle brand Quantron and intelligent driving technology company HyperView. The group will serve as the industrial manufacturing partner for Quantron China's truck and bus platforms, producing next-generation zero-emission commercial vehicles for international markets....
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20.09.26 - 02:36
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Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership (Digitimes)
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German commercial vehicle company Quantron and China's Hongjing Drive have formally agreed to establish a joint venture, Quantron China, to develop a China-Europe technology and industrial platform for next-generation zero-emission commercial vehicles. Foxconn will serve as the industrial manufacturing partner for truck and bus platforms, supporting their international deployment....
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18.09.26 - 12:12
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Quantron und HyperView gründen China-Joint-Venture (Electrive)
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Quantron und das chinesische Technologieunternehmen HyperView haben die Gründung eines gemeinsamen Unternehmens in China vereinbart. Quantron China soll eine neue Plattform für Batterie-elektrische und Wasserstoff-betriebene Nutzfahrzeuge entwickeln, während Foxconn als industrieller Fertigungspartner an Bord kommt....
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18.09.26 - 09:48
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Haller Group: QUANTRON und HyperView gründen chinesisches Joint Venture (Anleihen-Finder)
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Mitteilung der Haller Group: QUANTRON und HyperView gründen QUANTRON China – mit Foxconn als industriellem Fertigungspartner für die nächste Generation emissionsfreier und intelligenter Nutzfahrzeuge Deutsche […]
Der Beitrag Haller Group: QUANTRON und HyperView gründen chinesisches Joint Venture erschien zuerst auf Anleihen-Finder.de....
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18.09.26 - 02:36
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FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks (Digitimes)
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Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization and visibility extending through 2027. Optical communications products began shipping in small volumes in 2026 and are expected to scale further in 2027 and 2028, though adoption will ultimately follow customers. "We cannot run faster than our customers," Lu said....
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17.09.26 - 06:24
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Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects (Digitimes)
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Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September 16 under the theme "Light at Scale: The Next Frontier in Data Center Interconnects," bringing together global leaders from the optical communications, AI, and semiconductor industries to examine the next generation of AI connectivity across light sources, materials, photonics, network architecture, manufacturing, and the broader industry ecosystem....
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17.09.26 - 06:06
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FIT ramps up optical interconnect push as AI race shifts to connectivity (Digitimes)
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At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus is shifting from simply pursuing greater computing power to improving the overall efficiency of data centers. He said the key to the next 10 years of AI lies not only in chips and computing performance, but also in whether data can flow smoothly within data centers and across different systems through faster, more stable, and more efficient connectivity....
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17.09.26 - 05:06
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Foxconn links FII and FIT to tackle AI infrastructure beyond the chip (Digitimes)
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Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration — to move beyond standalone product supply toward system-level solutions across AI servers, high-speed interconnects, optical communications, power and cooling....
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16.09.26 - 05:06
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Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030 (Digitimes)
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Sharp Corporation began taking orders in Japan on September 15 for AI servers procured from its Taiwanese parent, Foxconn, and equipped with Nvidia processors, giving the display and consumer electronics maker a route into domestic AI infrastructure at a moment when GPU supply remains tight. The company said commercial sales are planned for fiscal 2027, and it is targeting revenue of around JPY250 billion (about US$1.6 billion) in fiscal 2030, according to Kyodo News....
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11.09.26 - 00:06
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Foxconn′s global expansion signals a longer-term manufacturing shift (Digitimes)
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Kathy Yang, chief campus operations officer at Foxconn, said the company began moving abroad more than a decade ago as production shifted toward lower-cost regions, and that its global footprint has since become a source of supply chain resilience. Speaking at an Empower Women For A Better World forum in Taiwan on September 9, she said the strategy was planned well before the pandemic, and geopolitical tensions accelerated industry change....
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08.09.26 - 11:06
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FIT wins Amphenol patent license, expands AI interconnect push (Digitimes)
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Foxconn Interconnect Technology (FIT) announced on September 7, 2026, that it has secured a patent license from competitor Amphenol for high-speed backplane connector solutions. The two companies also issued a joint statement, saying the collaboration marks an important milestone in advancing core technologies for the AI era and will let them offer customers a more complete service package....
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