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30.10.26 - 18:01
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Foxconn: AI Will Boost Consumer Electronics (Bloomberg)
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Foxconn Rotating CEO Michael Chiang says AI industry will boost the consumer electronics business. In an exclusive conversation with Bloomberg's Annabelle Droulers, Chiang says that in-region manufacturing is more critical. (Source: Bloomberg)...
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30.10.26 - 14:54
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Foxconn Chairman: AI Demand is Real (Bloomberg)
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Foxconn, also known as Hon Hai, is counting on a steady US expansion and a partnership with OpenAI to help hit its goal of capturing half the AI server market within two years. Chairman Young Liu spoke with Bloomberg's Annabelle Droulers, after earlier Friday meeting with OpenAI chief Sam Altman to discuss their partnership. He said AI demand is real and pointed to major cloud spending as a sign of strong momentum. (Source: Bloomberg)...
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30.10.26 - 13:31
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50 Prozent bei KI-Servern: Apple-Zulieferer mit Kampfansage (Der Aktionaer)
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Foxconn bläst im KI-Geschäft zum Angriff. Der weltgrößte Auftragsfertiger will sich die Hälfte des globalen Marktes für KI-Server sichern. Die Auftragsbücher sind bereits prall gefüllt, die Kapazitäten auf lange Zeit ausgebucht. Für den Apple-Zulieferer beginnt damit eine neue Wachstumsdimension....
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30.10.26 - 10:37
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HHTD 26: Mitsubishi Electric Mobility to join Foxconn in 2027, targeting JPY1T revenue by 2030 (Digitimes)
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Speaking at Hon Hai Tech Day (HHTD 26), Kazunori Tanaka, Representative Director and President of Mitsubishi Electric Mobility, emphasized that the company's core competitiveness in EV platforms has decisively pivoted toward software—spanning electric powertrains, autonomous driving, and in-cabin intelligence. Tanaka announced that Mitsubishi Electric Mobility will officially join the Foxconn family in October 2027, leveraging complementary strengths to target JPY1 trillion (approx. US$6.4 billion) in annual revenue by 2030....
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30.10.26 - 10:37
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HHTD 26: The year robots share the stage with AI infrastructure (Digitimes)
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Hon Hai Tech Day 2026 (HHTD 26) continued to focus on next-generation AI infrastructure. Although the event featured slightly fewer robots than in 2025, it still maintained a dedicated robotics exhibition area where Foxconn and its partners showcased the latest developments in smart manufacturing technology. Participants included KUKA, ABB, and Yaskawa, which are among the four major robotics families, as well as Japanese passive-component manufacturer TDK. Taiwan-based companies including Hiwin, TM Robot, and TECO also joined the exhibition....
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30.10.26 - 10:06
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Foxconn argues it is more than a box mover in AI hardware (Digitimes)
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Foxconn chairman Young Liu said the company's core strengths are processing capabilities and vertical integration, as the manufacturer seeks to move beyond its long-standing image as a simple "Box Mover." At its 2026 Hon Hai Tech Day, Liu described an end-to-end model spanning design, components, assembly, software integration, and global logistics....
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30.10.26 - 10:06
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Foxconn, TECO showcase factory-built infrastructure for AI data center expansion (Digitimes)
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Hon Hai (Foxconn) and TECO Electric & Machinery showcased a jointly developed modular data center at Hon Hai Tech Day 2026, highlighting a factory-built approach to AI infrastructure. The 40-foot container integrates computing, cooling, power, energy management, and fire protection systems, as the companies target rising global demand for AI computing capacity....
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30.10.26 - 10:06
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Google, Foxconn aims to cut AI infrastructure deployment to six months (Digitimes)
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Google is deepening its strategic partnership with Foxconn to accelerate AI infrastructure deployment, aiming to cut the time from chip supply to data-center deployment from the traditional 12 to 18 months to about six months, said Rehan Sheikh, vice president of global silicon chip technology and manufacturing at Google Cloud, at Hon Hai Tech Day (HHTD 26) on October 30....
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