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24.04.26 - 11:06
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Chipmakers face higher cost pressure as packaging outpaces foundry price hikes (Digitimes)
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In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers. These moves aim to pass on steadily rising manufacturing costs across the supply chain as outsourced semiconductor assembly and test (OSAT) costs surge faster than even foundry price increases....
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24.04.26 - 11:06
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M31 and TSMC complete eUSB2V2 tapeout on N2P process (Digitimes)
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IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the manufacturing platform to boost design efficiency and accelerate time-to-market....
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24.04.26 - 11:06
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Memory price surge reshapes global notebook competition in 2026 (Digitimes)
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The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities as the core of competition. Memory supply chain control has emerged as a key indicator of brand competitiveness, directly impacting shipment volumes and operational performance....
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24.04.26 - 10:06
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TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker (Digitimes)
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The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding's equipment orders may also be affected as the supply chain undergoes potential realignment....
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24.04.26 - 10:06
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Liteon startup platform sharpens edge AI ecosystem focus for 2026 growth reset (Digitimes)
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Liteon's startup platform LITEON+ held its 2026 Demo Day, marking its third year, with a focus on key technologies including edge AI, AI chips, thermal sensing, power conversion, and agentic AI. The event showcased the latest collaboration outcomes between Liteon and global startup partners in advancing human-machine co-creation and real-world industrial deployment....
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24.04.26 - 06:06
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AI PCB supply crunch squeezes margins on rising materials and energy costs (Digitimes)
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A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from T-glass fiberglass cloth for IC substrates to longer lead times for copper-clad laminates (CCL), with prices for multiple upstream inputs rising in tandem....
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24.04.26 - 06:06
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FSET eyes local battery recycling and storage by 2027 (Digitimes)
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Amid rising electricity demand driven by geopolitical tensions and AI growth, Formosa Smart Energy Tech (FSET) is advancing its battery recycling and energy storage strategy to build a localized circular supply chain. The company plans to establish Taiwan's first waste battery recycling line in Changhua County, targeting completion by the fourth quarter of 2027 with an initial capacity of 720 tons....
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24.04.26 - 06:06
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Commentary: DeepSeek rethinks funding strategy under talent drain and AI race (Digitimes)
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The trajectory of DeepSeek has drawn scrutiny, but its latest move marks a clear inflection point. According to a report by The Information, the company is seeking external funding for the first time, triggering strong interest from China's major tech groups. Four sources familiar with the matter said Tencent and Alibaba are in discussions to invest....
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