|
|
|
|
|
07.04.26 - 11:06
|
Wonderful Hi-Tech bets on AI servers and satellites for next growth wave (Digitimes)
|
|
|
After a slower second half of 2025, marked by elevated customer inventories and a softer ordering pace, high-end cable material provider Wonderful Hi-Tech anticipates a rebound in 2026. According to the company, inventory adjustments are largely concluding in the first quarter, and customer orders and shipments have been steadily picking up since March, setting the stage for a quarter-by-quarter acceleration in revenue. The company aims to surpass its previously stated NT$10 billion (approx. US$313 million) revenue target, with Chairman Ming-Lieh Chang noting that current trends suggest actual results could exceed that benchmark....
|
|
|
07.04.26 - 11:06
|
Advantech tops US$635 million in 1Q26 revenue on edge AI demand surge (Digitimes)
|
|
|
Driven by accelerating real-world deployment of edge AI applications across major global markets, industrial PC (IPC) maker Advantech reported March 2026 consolidated revenue of NT$7.7 billion (approx. US$240 million), up 21.75% from NT$6.32 billion a year earlier. For the first three months of 2026, cumulative revenue reached NT$20.39 billion, marking a 17.49% increase from NT$17.35 billion in the same period of 2025....
|
|
|
07.04.26 - 11:06
|
IndieSemiC eyes India′s general-purpose chip gap with Kaynes OSAT deal (Digitimes)
|
|
|
India-based fabless startup IndieSemiC is betting that its new OSAT partnership with Kaynes Semicon can help it move from RF modules into vertically integrated chip products. However, the company acknowledged that the headline volume tied to the collaboration is still based on expected customer adoption rather than firm orders....
|
|
|
07.04.26 - 11:06
|
Quobly moves quantum chips into volume production (Digitimes)
|
|
|
French quantum chip startup Quobly has continued to report progress while expanding its partnership network. The company has set up a new presence in Canada and gained recognition at the American Physical Society meeting, where it was identified as a potential key player in the emerging quantum computing era....
|
|
|
07.04.26 - 11:06
|
FOPLP and WMCM emerge as key to fan-out packaging competitive field (Digitimes)
|
|
|
The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a key next-generation solution for applications such as AI mobile devices and high-performance computing (HPC). As a result, it has become a new battleground actively pursued by both foundries and OSAT providers....
|
|
|
|
|
|
|
07.04.26 - 11:06
|
From components to systems: Ennostar to highlight optical comms, automation tech at Touch Taiwan (Digitimes)
|
|
|
As the optoelectronics industry shifts from competition in individual components toward systems integration and higher value-added applications, optoelectronics solution provider Ennostar is focusing on two emerging sectors with long-term growth potential at the Touch Taiwan 2026 exhibition, running from April 8-10: optical communications and sensing, and automation. The company is also integrating its two core technologies of microLED and miniLED with automotive optoelectronics, presenting a comprehensive layout across four high-value application segments....
|
|
|
07.04.26 - 11:06
|
China seeks break from Nvidia CUDA grip in AI chips (Digitimes)
|
|
|
Generative AI is concentrating control of computing power within a narrow set of architectures and ecosystems. Wei Shaojun, chairman of the IC design branch of the China Semiconductor Industry Association and a professor at Tsinghua University, said AI competition now extends beyond hardware to control of rules and ecosystems, warning that continued reliance on existing systems could lock China into long-term dependence on critical technologies....
|
|
|
07.04.26 - 11:06
|
Rapid deployment and flexible scalability drive the rise of modular data centers (Digitimes)
|
|
|
As GPU platforms continue to iterate each year, the buildout of AI infrastructure is accelerating in tandem. For data center operators, cloud service providers, hyperscalers, and large enterprises, the challenge is no longer just building the facility, but rather how to bring computing power online faster while preserving flexibility for future upgrades and expansion....
|
|
|
|
|
|
|
|
|
|
|
07.04.26 - 09:06
|
Global AI chip suppliers compete as TSMC remains top foundry partner (Digitimes)
|
|
|
As the artificial intelligence (AI) era advances, approximately 133 companies are actively developing or selling AI chips, according to a SEMIEcosystem report citing Jon Peddie Research. Major suppliers include Nvidia, AMD, Broadcom, and Google, alongside numerous startups focusing on edge AI solutions....
|
|
|
|
|
07.04.26 - 08:06
|
MediaTek, Qualcomm reportedly cut smartphone AP orders with TSMC (Digitimes)
|
|
|
Amid soaring memory prices, manufacturers have repeatedly lowered 2026 shipment targets for smartphones, PCs, and other consumer electronics, triggering a ripple effect across the supply chain. Recently, reports emerged that major Chinese smartphone brands are scaling back purchases of processors, forcing MediaTek and Qualcomm to reduce their subsequent orders with TSMC, with estimated cuts of 10-15% in wafer starts on 4/3nm processes....
|
|
|
07.04.26 - 07:06
|
Innodisk revenue jumps 4x in March, first-quarter hits record (Digitimes)
|
|
|
Memory module maker Innodisk extended its strong growth momentum in March 2026, reporting monthly revenue of NT$5.67 billion (approx. US$177.34 million), up 35.8% month-over-month and 484.8% year-over-year. First-quarter revenue reached NT$13.18 billion, also a record high....
|
|
|
|