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02.01.26 - 01:42
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Chinese AI firms ramp up expansion in Singapore amid fierce local competition (Digitimes)
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Facing stiff competition in the domestic market, Chinese technology companies are accelerating their push into international markets, with artificial intelligence (AI) firms spearheading efforts in Singapore. According to The Straits Times, these companies plan to introduce a wide range of AI products, including robots, large language models (LLMs), and cloud solutions by 2026 to tap into Singapore's growing technology sector....
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02.01.26 - 01:42
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ByteDance plans US$14B Nvidia H200 chip purchase in 2026 (Digitimes)
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ByteDance is reportedly preparing to invest about CNY100 billion (US$14.3 billion) in AI chips in 2026, primarily purchasing AI processors from Nvidia. This planned spending exceeds the estimated CNY85 billion for 2025 but remains contingent on whether Nvidia receives approval to sell its H200 chips in the China market, with budget adjustments possible....
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02.01.26 - 01:42
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Server ODMs remain bullish through the end of 2026 despite bubble concerns (Digitimes)
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Although AI bubble concerns persist, server ODMs remain optimistic about 2026. Nvidia's GB300 began shipping in the fourth quarter of 2025, and the new Vera Rubin architecture expected in 2026 should be able to take over smoothly. However, the Vera Rubin Ultra is slated to debut in 2027, which will involve a major overhaul of rack architecture and pose a significant challenge....
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01.01.26 - 08:54
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AI competition moves beyond LLMs into distribution and hardware channels (Digitimes)
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As frontier AI models reach practical usability, competition is shifting from incremental improvements in model performance to a broader battle over distribution, application integration, and cost-effective deployment, according to DIGITIMES analyst Luke Lin. Developers are now racing to secure access to end users via devices and platforms, marking a new phase in AI competition that is expected to last for the next several years....
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01.01.26 - 08:54
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Samsung reportedly explores side-by-side chip packaging for next-gen Exynos (Digitimes)
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Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically....
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01.01.26 - 08:54
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Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks (Digitimes)
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Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical inspection equipment. Chairman Peter Chin said the product passed foundry customer validation and secured the first order for a non-destructive through-silicon via (TSV) inspection system, slated for shipment and revenue contribution in the first half of 2026. This milestone marks the group's transition into a new business phase....
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31.12.25 - 12:06
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Taiwan government backs AI robots to address labor shortages (Digitimes)
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Taiwan's aging population and declining birth rates have led to an increasingly pressing labor shortage, a major structural issue uncovered through a National Taiwan University (NTU) study commissioned by the National Development Council (NDC) on how demographic shifts impact policies. Under this backdrop, industry experts see high potential for the robotics sector, but cost reduction and improved intelligence remain key challenges for widespread adoption....
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31.12.25 - 12:06
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Samsung reportedly poised to clear KRW20 trillion profit mark in 4Q25 (Digitimes)
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Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial intelligence infrastructure lifts memory chip prices. The reports, compiled by South Korean outlets including Korea Economic Daily and EBN and citing industry sources, said Samsung's preliminary fourth-quarter operating profit is expected to exceed KRW20 trillion, a level that would mark the first time a South Korean company has crossed that threshold in a single quarter....
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31.12.25 - 11:01
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Z.ai illustrates how open-source AI models are influencing commercial adoption (Digitimes)
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On December 30, Chinese AI company Z.ai launched a share sale to raise HK$4.35 billion (approx. US$560 million), aiming to become the first large language model (LLM) developer listed in Hong Kong amid a tech IPO surge, with a scheduled listing for January 8, 2026. Meanwhile, Z.ai has recently launched its latest open-source model, GLM-4.7, signaling a shift toward enterprise-focused AI and broader global adoption. As the company prepares for a 2026 IPO, the release highlights the growing influence of independent developers in a market increasingly shaped by hyperscale competitors and ecosystem distribution....
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