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22.01.26 - 11:01
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China rolls out trade-in subsidies again to support ICT device sales (Digitimes)
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Despite forecasts of a decline in sales of ICT products, including smartphones and notebooks, by 2026 due to memory supply shortages, China is introducing new purchase subsidies to sustain consumer demand. The government aims to bolster the market with trade-in incentives following policy measures implemented in early 2025....
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22.01.26 - 10:06
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How Sony-TCL tie-up could chip away at Samsung′s OLED advantage (Digitimes)
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Sony's decision to form a TV joint venture with TCL is being read in South Korea less as a routine corporate reshuffle than as a structural challenge to the country's long-held dominance in premium TVs and OLED panels. The deal has triggered unease not only about Sony's future role in TVs, but about whether Samsung Electronics can continue to dictate the industry's technological and competitive agenda....
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22.01.26 - 10:06
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SAS shifts SiC strategy with 12-inch wafers and AI glasses innovation (Digitimes)
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Facing intense price wars triggered by China's rapid expansion in the global silicon carbide (SiC) wafer industry, Sino-American Silicon Products (SAS) chairwoman Doris Hsu has decisively reshaped the company's resource allocation. She revealed that standard SiC wafer prices have plunged 60-70% within six months due to market turbulence. In response, SAS is withdrawing from the commoditized power segment for GlobalWafers' SiC wafers and prioritizing three niche markets focused on high-barrier applications....
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22.01.26 - 09:06
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Why Sony finally let go of TVs (Digitimes)
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Sony Group has decided to spin off its TV business and place it into a joint venture controlled by TCL, marking the company's formal retreat from a segment that once defined Japan's consumer-electronics prowess. The move underscores Sony's strategic pivot toward higher-margin businesses—gaming, music, and film—while reflecting a broader, decades-long withdrawal by Japanese firms from mass-market home appliances....
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22.01.26 - 09:00
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Commentary: In Bravia′s handover, can TCL keep Sony′s premium promise? (Digitimes)
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Sony Corporation and TCL Technology have signed a memorandum of understanding to form a joint venture that will take over Sony's home entertainment business, including TV and audio product R&D, manufacturing, operations, and after-sales services. The new entity is expected to begin operations as early as April 2027, effectively placing the future of the Bravia brand under TCL's operational control....
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22.01.26 - 09:00
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Kioxia warns of tight NAND supply through 2027 (Digitimes)
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Kioxia, the world's third-largest manufacturer of NAND flash memory, has largely exhausted its production capacity for the current year and expects tight supply conditions to persist through 2027, according to comments from a senior executive cited by South Korean media....
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22.01.26 - 08:06
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GlobalWafers′ Texas plant holds six-phase expansion potential (Digitimes)
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GlobalWafers chairwoman Doris Hsu said in a January 21, 2026, media interview that with easing inflation pressures and some central bank policy adjustments, the global economy is experiencing moderate growth despite ongoing challenges from geopolitical tensions and trade uncertainties....
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22.01.26 - 08:06
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GlobalWafers chair sees Taiwan′s semiconductor edge, says AI is irreversible (Digitimes)
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On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking most-favored-nation (MFN) rates. This makes Taiwan the first country to secure tariff relief under Section 232. Both sides also plan to expand supply chain investment cooperation. Hsu called this a very positive outcome for Taiwan's overall industry and said it has eased market concerns....
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22.01.26 - 08:06
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GlobalWafers eyes quarterly revenue growth in 2026; chair sees better market than last year (Digitimes)
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GlobalWafers chairman Doris Hsu told the media on January 21, 2026, that the company's global expansion plans are starting to pay off, with subsidiaries in Niigata and Utsunomiya, Japan, as well as Denmark, all hitting record revenues in 2025. Niche products like gallium nitride (GaN) stood out for their strong performance. Hsu also outlined GlobalWafers' 2026 strategy and shared her outlook on market conditions....
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22.01.26 - 07:42
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Chinese AI chipmakers face mixed reactions to Nvidia H200 block (Digitimes)
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The US has confirmed that under a new set of stringent regulations, Nvidia's H200 is permitted to be exported to the Chinese market, and Chinese customers have expressed strong demand. However, the Chinese government has shown no intention of granting approval, causing supply chain plans that were originally preparing to ship to be put on hold. Currently, the main obstacle to entering the Chinese market is the mindset of the Chinese authorities. From the Chinese government's perspective, since domestic AI chips are already usable, there is no need to further allow China's AI development to rely more heavily on the US and Nvidia....
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22.01.26 - 07:06
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Mercedes-Benz scales back L3 autonomy as AI reshapes the auto industry (Digitimes)
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Despite the debut of the Alpamayo self-driving AI architecture by Nvidia at CES 2026, Mercedes-Benz, the earliest adoptor of the architecture, instead turned to focus on enhanced Level 2 systems (L2+) with the removal of the L3 autonomous driving functionalities in the refreshed version of its flagship S-Class in late January....
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22.01.26 - 06:06
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EMS watch: Celestica and Flex double down on platform-led data center builds; Sanmina and Jabil expand through M&A and diversified portfolios (Digitimes)
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Electronics manufacturing services (EMS) providers are sharpening their competitive positions around AI-era infrastructure, shifting attention from cyclical end markets to longer-cycle platform builds for cloud, networking, and data centers. Recent company updates from Celestica, Sanmina, Jabil, and Flex show a common playbook: move up the value chain, standardize repeatable system designs, and invest in power, thermal, and integration capabilities that shorten deployment times for hyperscale customers....
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