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17.04.26 - 06:18
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TSMC revises advanced process and packaging strategy (Digitimes)
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TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue. New 3nm production capacities will come online sequentially in Taiwan, the US, and Japan between 2027 and 2028. Wei also revealed plans for CoPoS for the first time....
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17.04.26 - 06:18
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Sivers and Jabil partner on 1.6T optics to tackle AI power demands (Digitimes)
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Sivers Semiconductors and Jabil have announced a collaboration to develop a 1.6T optical transceiver module aimed at addressing the growing energy demands of AI data center interconnects. As hyperscale operators face increasing power constraints, the partnership is positioned as a high-efficiency solution for next-generation infrastructure....
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17.04.26 - 06:18
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Taiwan′s OSAT expansion could tighten global test capacity and raise costs (Digitimes)
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Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter advanced-test capacity, higher prices, and accelerated investment as Taiwanese OSATs boost capital spending and capacity, significantly affecting chipmakers and device makers worldwide into 2026 and beyond....
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17.04.26 - 06:18
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The tumor chip from Taiwan that catches what mouse trials miss (Digitimes)
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A year-old Hsinchu startup is heading to Silicon Valley. Fluidiconic Bio will join four other Taiwanese companies at the Plug and Play Silicon Valley Summit this May, pitching a high-throughput tumor-on-a-chip platform its founders believe can do what decades of animal testing cannot: accurately predict how a cancer drug behaves inside a human tumor....
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17.04.26 - 06:06
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Analysis: ASML lifts 2026 guidance on strong EUV demand (Digitimes)
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ASML delivered first-quarter 2026 results that exceeded expectations, prompting management to raise its full-year guidance despite a cautious outlook for the second quarter. The company announced plans to expand its extreme ultraviolet (EUV) manufacturing capacity to meet strong demand expected in 2027. The updated outlook suggests stronger momentum in the second half of 2026....
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17.04.26 - 06:06
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Intel expands foundry push with Samsung executive hire (Digitimes)
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Intel, which is working to scale its outsourced chip manufacturing business, has hired Samsung Electronics executive Shawn Han to strengthen its foundry operations and customer engagement strategy, according to reporting from Bloomberg and Oregon Live....
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17.04.26 - 04:06
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TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity (Digitimes)
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TSMC delivered an above-expectations financial performance in the first quarter of 2026 and remains optimistic about continued strong demand for advanced process technologies entering the second quarter. Regarding tight capacity constraints, Chairman C.C. Wei stated that while capacity remains tight, the company is actively expanding new fabs to meet demand. However, he noted that building new facilities takes time, so supply will remain limited in the short term. Still, the company will continue efforts to increase capacity to support customer demand and will not deliberately select or favor any particular customer....
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17.04.26 - 01:54
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Meta′s Manus deal further exacerbates Chinese startups′ exodus to Singapore and US (Digitimes)
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The US$2 billion acquisition of AI startup Manus by Meta Platforms has sent shockwaves through the Chinese tech ecosystem, exposing the fragility of the "Singapore-washing" strategy that many founders once relied on to sidestep geopolitical crossfires. The deal, which was finalized in early 2026, triggered an aggressive response from Beijing, forcing a sweeping reallocation of resources among startups operating in the gray zone between Chinese origins and global ambitions....
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17.04.26 - 01:54
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Interview: Semidynamics expands from SoC to rack-level solutions, targeting memory-intensive AI inference (Digitimes)
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Spain-based AI chip startup Semidynamics has recently seen a wave of positive developments. Its first chip, fabricated on TSMC's 3nm process, has successfully completed tape-out, and just weeks ago, the company secured an investment commitment from SK Hynix. Both significantly enhance its operational credibility and global visibility. CEO Roger Espasa stated that the company's proprietary Gazzillion technology is a specialized memory subsystem designed to address one of AI's most pressing challenges today: inefficient memory utilization, which has led to persistent supply constraints....
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