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13.03.26 - 01:31
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Samsung targets 2nm process for HBM4E base die to boost AI chip edge (Digitimes)
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Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological competitiveness. Industry experts see this as part of Samsung's broader strategy to leverage its advantage as a leading integrated device manufacturer (IDM) in the global AI semiconductor race....
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13.03.26 - 01:31
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Flexium eyes 30% revenue from AI servers and smart glasses in 2026 (Digitimes)
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After a challenging 2025, flexible printed circuit (FPC) giant Flexium Interconnect is optimistic about its revenue and profit outlook, driven by accelerated transformation in high-speed transmission products. The company expects full-year growth in 2026 fueled by strong demand in two key sectors: new models for major US smartphone customers and applications in AI servers and wearable devices....
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13.03.26 - 01:31
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Taiwan PCB output reaches $43B in 2025, TPCA says (Digitimes)
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The Taiwan Printed Circuit Board Association (TPCA) held its annual member meeting, where chairman Lawrence Chang announced projections for the industry through 2026. The announcement included both growth expectations and a newly released risk governance strategy....
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13.03.26 - 01:31
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AW 2026: a reality check for the fully autonomous era (Digitimes)
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Global headlines may proclaim a fully autonomous era, but AW 2026 told a different story. The show made clear that robots are not yet fully autonomous — a fact obscured by modern robotics coverage. The industry is heading in the right direction, but independent operation remains out of reach. A surprising number of robots were teleoperated via controllers. Those left unsupervised often struggled with basic environmental navigation....
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13.03.26 - 01:31
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Sysgration targets double-digit growth in AI server BBU power in 2026 (Digitimes)
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Leveraging a dual-track strategy in AI server power supplies and AI edge computing applications, electronic components maker Sysgration announced it has officially transitioned from its preparation phase into a harvesting period. Helped along by Pegatron's strategic investments, the company expects operational growth to reach double digits in 2026, with growth in data centers fueling demand for battery backup units (BBUs)....
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13.03.26 - 01:07
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Hotai Group shifts Taiwan car market strategies from volume to value in 2026 (Digitimes)
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As a key player in Taiwan's automotive industry, Hotai Group draws significant attention with its annual outlook released early each year, which is generally seen as an indicator of local market developments. In its latest report, Hotai Motor projected that new car sales in Taiwan will reach 440,000 units in 2026, while setting a combined target sales volume of 165,000 vehicles and a 37.5% market share across the Toyota, Lexus, and Hino brands....
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12.03.26 - 11:02
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JetCool, Broadcom partner on liquid cooling for AI chips (Digitimes)
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JetCool, a subsidiary of Flex, has partnered with Broadcom to develop liquid cooling solutions for next-generation AI processors, according to a press release issued March 11. The collaboration aims to address rising thermal demands as AI chip power densities continue to increase....
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12.03.26 - 10:06
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Middle East conflict rattles energy markets, squeezes IC distributors (Digitimes)
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The ongoing Middle East conflict is disrupting global oil and natural gas supplies and triggering an energy crisis that has pushed up international crude prices. Market expectations for higher inflation have risen, potentially delaying the US Federal Reserve's timeline for interest rate cuts, industry participants say....
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12.03.26 - 10:06
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Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26 (Digitimes)
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Semiconductor testing firm Ardentec is optimistic about its future operations, driven by sustained strong orders in communication applications. The company expects a resilient first quarter of 2026 with utilization rates around 70%. Meanwhile, new AI ASIC wafer test capacity at its Longtan plant will gradually come online in the second half of 2026, serving as a key growth driver for the full year....
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