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Nvidia CEO Jensen Huang issued a sharp rebuke to market speculation regarding the rise of custom silicon (ASIC) during an interview in Taipei on January 31, 2026....

Nvidia CEO Jensen Huang delivered a fiery defense of his company's alliance with OpenAI on Saturday night, January 31, 2026, dismissing reports of a "cooling" relationship as "complete nonsense."...

Nvidia CEO Jensen Huang hosted a high-profile banquet in Taipei on January 31, 2026, for the leaders of Taiwan's semiconductor ecosystem....

Nvidia CEO Jensen Huang attended the company's Taiwan branch year-end party on January 30. Notably, he was accompanied by Vanessa Lee, the former TSMC Vice President of Materials Management, who managed the event's arrangements....

Automobiles are rapidly transforming into servers/smartphones-on-wheels with the advancement of autonomous driving technologies, which has led to a surge in demand for automotive memory. Samsung Electronics and SK Hynix are viewing the automotive sector as the next major battleground after AI, with both South Korean memory giants taking proactive measures to gain a foothold in this emerging market....

The draft rules for vendor selection in offshore wind power Phase 3-3 have, for the first time, removed localization requirements. However, this has not slowed investment in Taiwan by companies including Century Iron & Steel. Because localization requirements impact domestic suppliers that have already made substantial investments, Century Group calls for a gradual policy adjustment. As the Asia-Pacific offshore wind market continues to grow, Century Group is also accelerating the build-out of production capacity in Indonesia, with plans to explore export opportunities in Japan and South Korea....

Copenhagen Infrastructure Partners (CIP), through its fifth flagship fund Copenhagen Infrastructure V (CI V), held a milestone event on January 29, 2026, at Taipei Port to showcase the completion of the first batch of subsea foundation assemblies for the Fengmiao Offshore Wind Farm. The project is on track for full completion in 2027....

The global energy storage system (ESS) market based on lithium-ion batteries expanded in 2025. According to ET News and Ddaily, SNE Research reported that global shipments of lithium-ion batteries for ESS by manufacturers totaled 550 GWh in 2025, up 79% from 307 GWh in 2024, reflecting strong growth momentum. However, China alone accounted for more than 60% of the total. Unlike electric vehicle (EV) batteries, which are installed in vehicles and then sold to consumers, ESS batteries are typically deployed directly into regional projects. As a result, there is little discrepancy between shipment volumes and actual installed capacity....

At a Lunar New Year press conference, the Financial Supervisory Commission said that combined revenues of Taiwan's listed companies surpassed NT$50 trillion (approx. US$1.59 trillion) in 2025, while total market capitalization reached NT$101 trillion. By market value, Taiwan now ranks as the world's seventh-largest securities market....

In early 2026, a research update published by Sandia National Laboratories (SNL), part of the US Department of Energy, sparked industry discussions about whether Intel is poised to re-enter the DRAM market. Although the report did not explicitly confirm Intel's large-scale comeback in DRAM manufacturing, the signals it released warrant consideration....

Shenzhen Ingchips Technology has joined Goke Microelectronics and Cmsemicon in announcing price increases, highlighting mounting cost pressures across China's semiconductor supply chain....

LG Display, fresh off its first profitable year in four years, is preparing to step up investment in 2026 as it seeks to strengthen its position in the increasingly competitive OLED market. Despite that, the company is proceeding cautiously on one of the industry's most closely watched questions: whether and when to commit to large-scale production of next-generation OLED panels for IT devices....

TSMC founder Morris Chang made his first public appearance in more than a year on January 29, 2026, dining with Nvidia chief executive Jensen Huang just hours after Huang arrived in Taipei....

Elon Musk's ambition to build a massive in-house semiconductor manufacturing complex has drawn fresh caution from Nvidia CEO Jensen Huang, who stressed that advanced chip production ranks among the most technically demanding industrial undertakings globally—far beyond the reach of capital spending alone....

US semiconductor equipment maker KLA said growing AI infrastructure demand is accelerating investment in advanced logic chips, high-bandwidth memory (HBM), and advanced packaging, driving higher process control intensity, while supply constraints and cost pressures remain ongoing risks....

China has given its leading AI startup DeepSeek approval to buy Nvidia's H200 artificial intelligence chips, with regulatory conditions still being finalized, according to Reuters....

After TSMC chairman C.C. Wei said on a recent earnings call that AI demand is real and that AI is becoming embedded in daily life as a long-term trend, expectations for ASML's performance and outlook have largely settled....

Cloud service providers (CSPs) continue to maintain strong capex, driving steady growth in AI servers and high-speed network switches markets while elevating the grade of copper-clad laminate (CCL) materials. As orders for high-end products gradually increase, Taiwan's top three CCL manufacturers are set to deliver significant revenue growth with double-digit year-over-year gains in 2025....

SanDisk delivered a strong fiscal second quarter in 2026, reflecting accelerating demand across data centers, industrial applications, and consumer electronics, driven by the ongoing AI infrastructure buildout. The US flash memory maker reported revenue of US$3.03 billion, up 61% year over year, while net profit surged 7.7-fold to US$803 million, according to its January 29, 2026, earnings release....

AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight. The primary bottleneck stems from continuously expanding chip sizes, which introduce warpage and thermal stress challenges while driving ABF substrate demand to multiply, creating structural supply pressure and underpinning a recovery in 2025 operations for Taiwan's three leading IC substrate makers....