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17.01.26 - 16:00
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Internal memo reveals Micron has locked in PSMC HBM capacity through prepayment (Digitimes)
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Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant to Micron Technology, confirming that the transaction is paired with a broader cooperation framework that includes prepaid reservations for high-bandwidth memory (HBM) back-end wafer manufacturing capacity....
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17.01.26 - 12:06
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Top 10 Chart: Taiwan′s IC design sector ends 2025 with an AI-led split (Digitimes)
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Taiwan's IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer electronics-facing lines weakened amid seasonality, cautious panel and handset component pull-ins, and ongoing inventory adjustment....
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17.01.26 - 12:06
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Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition (Digitimes)
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AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia's GB200 NVL series release and Google's TPU-based rack product plans disclosed by Broadcom, underscoring an industry trend toward delivering computing power through integrated system platforms rather than isolated chips....
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17.01.26 - 12:06
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NIAR launches chip-level advanced packaging platform to boost Taiwan′s semiconductor edge (Digitimes)
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As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical technology shaping technological competitiveness and industrial layout. On January 13, 2026, Taiwan's National Institutes of Applied Research (NIAR) unveiled its chip-level advanced packaging R&D platform....
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17.01.26 - 05:06
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US rollback on Chinese drone ban to only have limited influence on Taiwan IPC sector (Digitimes)
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The US Department of Commerce recently revoked restrictions imposed by the Federal Communications Commission (FCC) in late December 2025 that banned imports of new drones and components from Chinese manufacturers, including DJI and Autel Robotics, due to national security concerns. This reversal complicates earlier assumptions that Taiwanese suppliers would gain significantly from displaced orders. However, industry experts suggest the impact on Taiwan's industrial PC (IPC) sector may be limited....
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17.01.26 - 05:06
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Amkor to close longstanding Japan chip plant as EV demand slows (Digitimes)
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Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by December 2027, citing weak demand stemming from a slowdown in the global electric vehicle (EV) market. The factory, located in the town of Nanae in Hokkaido, specializes in packaging chips used in automobiles....
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17.01.26 - 05:06
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Samsung DS rebounds to record KRW20 trillion under new leadership (Digitimes)
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Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing the company's decline in high-bandwidth memory (HBM) technology. Samsung's semiconductor business, once trailing behind Korean rival SK Hynix, has regained competitiveness amid rising AI demand, according to reports from JoongAng Daily and The Korea Times....
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17.01.26 - 00:48
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Apple′s LCD demand gives Radiant room to expand into AR and OLED (Digitimes)
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Radiant, a key supplier of Apple's backlight modules, is positioning itself to benefit from both legacy and emerging display technologies. While Apple continues to push toward OLED products as a long-term strategy, LCD devices remain in demand through 2026, giving Radiant room to expand into new business lines....
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17.01.26 - 00:48
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Canon eyes 2027 inkjet wafer planarization launch (Digitimes)
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Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities during semiconductor manufacturing. The process applies resin materials using inkjet printing and then presses a glass plate onto the surface, using a stamping-like method to achieve planarization....
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17.01.26 - 00:48
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Packaging and testing cluster expected to emerge as TSMC Arizona GigaFab expands (Digitimes)
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During TSMC's first earnings call of 2026, CEO C.C. Wei said that key metrics at its Arizona fabs are approaching the level of advanced manufacturing in Taiwan. Rising demand from US-based AI customers supports TSMC's capacity expansion in the US, prompting back-end packaging and testing supply chain partners to consider expanding their US presence....
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