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25.04.26 - 09:06
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LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand (Digitimes)
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Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare early for second-half 2027 demand, and aims to introduce semiconductor-grade equipment for processes involving substrates larger than 6 inches, targeting a new expansion phase starting in 2028....
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25.04.26 - 04:06
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Taiwan′s industrial production surges on AI infrastructure demand (Digitimes)
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Data released by Taiwan's Ministry of Economic Affairs (MOEA) on April 23 showed that major global cloud service providers continue to expand procurement of artificial intelligence (AI) hardware as countries worldwide build out AI infrastructure. As a result, industrial production of computer, electronic, and optical products — primarily AI servers — surged 146.32% in March 2026. Cumulatively, output from January to March rose 131.77% compared with the same period in 2025....
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24.04.26 - 11:06
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Chipmakers face higher cost pressure as packaging outpaces foundry price hikes (Digitimes)
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In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers. These moves aim to pass on steadily rising manufacturing costs across the supply chain as outsourced semiconductor assembly and test (OSAT) costs surge faster than even foundry price increases....
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24.04.26 - 11:06
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M31 and TSMC complete eUSB2V2 tapeout on N2P process (Digitimes)
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IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the manufacturing platform to boost design efficiency and accelerate time-to-market....
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24.04.26 - 11:06
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Memory price surge reshapes global notebook competition in 2026 (Digitimes)
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The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities as the core of competition. Memory supply chain control has emerged as a key indicator of brand competitiveness, directly impacting shipment volumes and operational performance....
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24.04.26 - 10:06
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TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker (Digitimes)
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The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding's equipment orders may also be affected as the supply chain undergoes potential realignment....
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24.04.26 - 10:06
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Liteon startup platform sharpens edge AI ecosystem focus for 2026 growth reset (Digitimes)
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Liteon's startup platform LITEON+ held its 2026 Demo Day, marking its third year, with a focus on key technologies including edge AI, AI chips, thermal sensing, power conversion, and agentic AI. The event showcased the latest collaboration outcomes between Liteon and global startup partners in advancing human-machine co-creation and real-world industrial deployment....
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