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11.04.26 - 11:06
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Sharp launches edge AI companion device with private cloud memory in Taiwan (Digitimes)
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Sharp's Poketomo launch in Taiwan illustrates how edge computing, combined with private cloud storage, is reshaping consumer AI devices, promising lower latency, enhanced privacy, and personalized, long-term interactions that could influence device strategies and regulatory expectations across markets and inform developer deployment choices worldwide....
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11.04.26 - 11:06
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Europe becomes the next testing ground for driverless taxis (Digitimes)
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The competition in robotaxis is expanding beyond the US and China into Europe, where 2026 is widely seen as the first year of commercial deployment. As domestic automakers and global players enter the market in tandem, a new contest is taking shape, one defined not just by algorithms, but by operating models and the path to profitability....
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11.04.26 - 03:06
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Taiwan partners with French drone leader to boost key tech, global supply chain (Digitimes)
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Taiwan has partnered with a major French drone manufacturer to build a secure and trusted supply chain network. Taiwan's Metal Industries Research and Development Center (MIRDC) announced it will collaborate with the French drone company on supply chains, key technology deployment, and market expansion — and a preliminary consensus has already been reached....
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11.04.26 - 02:24
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Analysis: What $70 billion in Taiwan hardware revenue tells you about the AI supercycle (Digitimes)
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Taiwan's listed AI hardware companies collectively generated $69.7 billion in March 2026 revenue across 13 supply-chain segments — up 63% year-over-year — offering the most comprehensive single-month snapshot yet of where global AI infrastructure spending is actually flowing. The table below covers 49 companies from TSMC's silicon foundry all the way down to the rail kits that slide servers into racks. Read together, the numbers tell a story that goes well beyond any single company's earnings call....
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11.04.26 - 02:24
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ASE leads US$3.4B advanced testing push in Renwu (Digitimes)
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Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE collaborated with WinWay and Horng Terng Automation (HTA) to jointly invest in building a high-end semiconductor testing service industrial park that will provide wafer and chip testing services....
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11.04.26 - 02:24
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Novatek hits 1Q26 revenue target on SoC, edge AI growth (Digitimes)
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Taiwanese display driver IC (DDI) leader Novatek Microelectronics reported March 2026 revenue of NT$8.47 billion (approx. US$266.32 million), up 19.9% from February but down 9.6% from the same period a year earlier. The company's total revenue for the first quarter of 2026 reached NT$23.15 billion, rising 1.4% sequentially and falling 14.6% year over year....
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10.04.26 - 23:06
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Analysis: Taiwan′s AI supply chain posts strong March revenues, signaling the buildout is still accelerating (Digitimes)
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Taiwan's listed companies powering the global AI server supply chain delivered exceptional March 2026 revenues across virtually every segment, with TSMC posting its strongest single-month revenue on record and server ODMs surging on the back of relentless hyperscaler demand for AI infrastructure. The results, amplified by a seasonal rebound from February's Lunar New Year-compressed working days, confirm that the AI hardware buildout is accelerating rather than plateauing....
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10.04.26 - 22:06
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Taiwan chip distributors report record quarter on AI boom (Digitimes)
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Taiwan's two largest semiconductor distributors, WT Microelectronics and WPG Holdings, reported record-breaking quarterly results, underscoring how surging demand for artificial intelligence infrastructure is rippling through the global chip supply chain....
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10.04.26 - 21:06
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BenQ Materials expands into semiconductor processes, targets advanced nodes (Digitimes)
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BenQ Materials is expanding into semiconductor materials, with president Ray Liu saying the company has entered CMP cleaning brush rollers and begun shipments to wafer fabs. It is also developing wafer grinding tapes and UV debonding tapes, which are currently under customer validation and could begin shipping as early as the end of 2026....
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