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On December 10, 2025, Qualcomm Inc. disclosed its acquisition of Ventana Micro Systems in the US without revealing the deal's financial terms or completion date. The company highlighted that the move would reinforce its global leadership in the RISC-V ecosystem and improve its CPU development capabilities, complementing its existing Oryon custom CPU team....

Apple has officially confirmed a strategic collaboration with Google to use the Gemini AI model to enhance Siri and other Apple Intelligence features. The two tech giants have revealed limited details about the arrangement, with internal sources shedding light on key aspects of the cooperation that carry broad implications for Apple's AI development and competitive positioning....

The automotive electronics industry is undergoing a structural transformation unlike any it has seen before. As artificial intelligence moves from the margins to the core of vehicle design, two of Taiwan's lesser-known industrial champions—HCMF Group and Kinpo Electronics—are deepening a cross-industry partnership aimed at navigating the upheaval. Their strategy rests on two pillars: system integration and a "global-local" manufacturing footprint, designed to withstand volatility in an increasingly fragmented market....

Meta Green Cooling (MGC) is making a comprehensive push into the AI liquid cooling sector, leveraging its unique full-spectrum capabilities. MGC chairman James Chen noted that, unlike competitors, MGC integrates mechanical design, electromechanical systems, thermal management, monitoring, data center design, and maintenance services under one roof. The company posted a remarkable 215% revenue growth in 2025 and expects similar expansion in 2026 as it capitalizes on rising liquid cooling demand....

SK Hynix has reportedly finished converting its key DRAM production facility in Wuxi, China, to the fourth-generation 1a process. The company reached the manufacturing milestone despite US export controls that limit exports of advanced semiconductor equipment to China....

South Korea's Intellectual Property Office (KIPO) signed a new Memorandum of Understanding (MOU) on intellectual property cooperation with China's National Intellectual Property Administration (CNIPA) during a China-South Korea leaders' meeting in Beijing in January 2026. It was the third such agreement, following earlier MOUs in 2013 and 2021....

SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven memory demand. The investment would add to existing packaging operations in Icheon and a planned facility in Indiana, creating a network spanning South Korea and the US....

Humanoid robots and embodied intelligence were huge at CES 2026. Dexterous hands are a key component that determines the upper limits of a robot's manipulation capabilities. Despite significant progress in recent years in terms of degrees of freedom and control performance, several challenges remain to be addressed....

Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant to Micron Technology, confirming that the transaction is paired with a broader cooperation framework that includes prepaid reservations for high-bandwidth memory (HBM) back-end wafer manufacturing capacity....

TSMC is speeding up its multibillion-dollar expansion in Arizona after posting strong earnings, signaling confidence in long-term artificial intelligence demand and the US push to rebuild domestic chip manufacturing....

Micron Technology said it has signed an exclusive letter of intent to acquire Powerchip Semiconductor Manufacturing Corporation's P5 fabrication site in Tongluo, Taiwan, in a cash transaction valued at US$1.8bn....

Render Network forecasts that 2026 will see brands adopting fully autonomous AI systems that reflect their identity across customer interactions, while consumer GPUs will enable creators and studios to run advanced AI models locally, expanding access to powerful AI workflows beyond large enterprises....

Taiwan's IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer electronics-facing lines weakened amid seasonality, cautious panel and handset component pull-ins, and ongoing inventory adjustment....

Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing expansion even as executives warn that new capacity will take years to meaningfully ease tight conditions in the global memory market....

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia's GB200 NVL series release and Google's TPU-based rack product plans disclosed by Broadcom, underscoring an industry trend toward delivering computing power through integrated system platforms rather than isolated chips....

As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical technology shaping technological competitiveness and industrial layout. On January 13, 2026, Taiwan's National Institutes of Applied Research (NIAR) unveiled its chip-level advanced packaging R&D platform....

The US Department of Commerce recently revoked restrictions imposed by the Federal Communications Commission (FCC) in late December 2025 that banned imports of new drones and components from Chinese manufacturers, including DJI and Autel Robotics, due to national security concerns. This reversal complicates earlier assumptions that Taiwanese suppliers would gain significantly from displaced orders. However, industry experts suggest the impact on Taiwan's industrial PC (IPC) sector may be limited....

The large-scale deployment of artificial intelligence servers has driven a sharp increase in demand for mass storage, with market sources saying NAND flash contract prices for the first quarter of 2026 are rising far more steeply than previously expected....

Tight memory supply has driven market prices sharply higher, prompting industry expectations that 2026 PC and smartphone end-demand will face downward pressure. However, TSMC stated that fluctuations in component costs like memory have a limited impact and remains optimistic about product lines such as high-end smartphones and PCs....

Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by December 2027, citing weak demand stemming from a slowdown in the global electric vehicle (EV) market. The factory, located in the town of Nanae in Hokkaido, specializes in packaging chips used in automobiles....