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Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant to Micron Technology, confirming that the transaction is paired with a broader cooperation framework that includes prepaid reservations for high-bandwidth memory (HBM) back-end wafer manufacturing capacity....

TSMC is speeding up its multibillion-dollar expansion in Arizona after posting strong earnings, signaling confidence in long-term artificial intelligence demand and the US push to rebuild domestic chip manufacturing....

Micron Technology said it has signed an exclusive letter of intent to acquire Powerchip Semiconductor Manufacturing Corporation's P5 fabrication site in Tongluo, Taiwan, in a cash transaction valued at US$1.8bn....

Render Network forecasts that 2026 will see brands adopting fully autonomous AI systems that reflect their identity across customer interactions, while consumer GPUs will enable creators and studios to run advanced AI models locally, expanding access to powerful AI workflows beyond large enterprises....

Taiwan's IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer electronics-facing lines weakened amid seasonality, cautious panel and handset component pull-ins, and ongoing inventory adjustment....

Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing expansion even as executives warn that new capacity will take years to meaningfully ease tight conditions in the global memory market....

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia's GB200 NVL series release and Google's TPU-based rack product plans disclosed by Broadcom, underscoring an industry trend toward delivering computing power through integrated system platforms rather than isolated chips....

As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical technology shaping technological competitiveness and industrial layout. On January 13, 2026, Taiwan's National Institutes of Applied Research (NIAR) unveiled its chip-level advanced packaging R&D platform....

The US Department of Commerce recently revoked restrictions imposed by the Federal Communications Commission (FCC) in late December 2025 that banned imports of new drones and components from Chinese manufacturers, including DJI and Autel Robotics, due to national security concerns. This reversal complicates earlier assumptions that Taiwanese suppliers would gain significantly from displaced orders. However, industry experts suggest the impact on Taiwan's industrial PC (IPC) sector may be limited....

The large-scale deployment of artificial intelligence servers has driven a sharp increase in demand for mass storage, with market sources saying NAND flash contract prices for the first quarter of 2026 are rising far more steeply than previously expected....

Tight memory supply has driven market prices sharply higher, prompting industry expectations that 2026 PC and smartphone end-demand will face downward pressure. However, TSMC stated that fluctuations in component costs like memory have a limited impact and remains optimistic about product lines such as high-end smartphones and PCs....

Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by December 2027, citing weak demand stemming from a slowdown in the global electric vehicle (EV) market. The factory, located in the town of Nanae in Hokkaido, specializes in packaging chips used in automobiles....

Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing the company's decline in high-bandwidth memory (HBM) technology. Samsung's semiconductor business, once trailing behind Korean rival SK Hynix, has regained competitiveness amid rising AI demand, according to reports from JoongAng Daily and The Korea Times....

Taiwan-based passive component maker Yageo said Japan's Shibaura Electronics was officially delisted from the Tokyo Stock Exchange on January 13. Following the completion of the share consolidation, Yageo now holds 100% of the voting rights in Shibaura Electronics as of January 15....

Radiant, a key supplier of Apple's backlight modules, is positioning itself to benefit from both legacy and emerging display technologies. While Apple continues to push toward OLED products as a long-term strategy, LCD devices remain in demand through 2026, giving Radiant room to expand into new business lines....

At its January 15, 2026, earnings call, TSMC chairman C.C. Wei addressed questions on the authenticity of AI demand, capital expenditure plans, and US capacity expansion. Wei stated that AI demand is real and sustainable, underpinning TSMC's aggressive investment strategy....

Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities during semiconductor manufacturing. The process applies resin materials using inkjet printing and then presses a glass plate onto the surface, using a stamping-like method to achieve planarization....

During TSMC's first earnings call of 2026, CEO C.C. Wei said that key metrics at its Arizona fabs are approaching the level of advanced manufacturing in Taiwan. Rising demand from US-based AI customers supports TSMC's capacity expansion in the US, prompting back-end packaging and testing supply chain partners to consider expanding their US presence....

In the inaugural episode of a new leadership podcast, Jensen Huang offers a strikingly unvarnished account of how Nvidia became one of the world's most valuable technology firms....

As the race to embed artificial intelligence into consumer devices heats up, Apple has formally confirmed a strategic partnership with Google to integrate the Gemini model into the next generation of Siri and Apple Intelligence. The tie-up between the two tech heavyweights is expected to sharpen Siri's capabilities and could also lift demand for Apple's future hardware....