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11.02.26 - 14:03
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WeShop Announces Offerings in the Health and Fitness Category with Nike, Adidas, GNC Under Armour and Other Leading Retailers (GlobeNewswire EN)
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NEW YORK, Feb. 11, 2026 (GLOBE NEWSWIRE) -- WeShop Holdings Limited (“WeShop” or the “Company”) (NASDAQ: WSHP), the world's first community-owned social commerce platform, today announced access to leading health and fitness brands, including Adidas, Under Armour, Nike, ASICS, and GNC, through its marketplace, helping consumers stay committed to their health and wellness goals well into the new year....
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11.02.26 - 00:42
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Novatek predicts memory and visual edge AI to be the main demand drivers in 2026 (Digitimes)
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Taiwanese display driver IC (DDI) giant Novatek recently held an investor briefing, where Vice Chairman and General Manager Steve Wang said that memory supply and costs will be the most critical factors affecting various electronic products, especially smartphones and PCs, in 2026. Aside from traditional DDI products, Novatek has recently made progress in new areas such as system-on-chip (SoC), application-specific ICs (ASICs), imaging, and edge AI. The company plans to continue launching new products and expand into diverse applications....
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05.02.26 - 04:06
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MediaTek charts data center ASIC expansion even as smartphone sales slow (Digitimes)
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MediaTek held its earnings briefing with investor focus centered on application-specific integrated circuits (ASICs) and the smartphone market outlook. CEO Rick Tsai said the company's data center ASIC business is expected to surpass US$1 billion in 2026 and reach several billion US dollars in 2027, with projects extending into 2028. Over the longer term, ASICs are projected to contribute around 20% of total revenue....
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30.01.26 - 01:00
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MediaTek, Alchip, Marvell clash for ASIC runner-up spot (Digitimes)
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The competition among cloud service providers (CSPs) and AI companies for application-specific integrated circuits (ASICs) has entered a new phase with Microsoft officially launching its Maia 200 chip. Industry forecasts indicate that 2027 will be a breakout year when multiple major players ramp up ASIC production simultaneously....
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23.01.26 - 05:06
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ASE Group′s USI merges with EugenLight to expand silicon photonics module capacity in Vietnam (Digitimes)
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ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific integrated circuits (ASICs), its subsidiary Universal Scientific Industrial (USI) is also expanding in optical communications. USI recently announced that it has completed the acquisition of a controlling stake in Chengdu-based EugenLight Technologies....
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19.01.26 - 09:06
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Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp (Digitimes)
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With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth memory, or HBM3E. Micron said at a recent earnings call that while demand for sixth-generation HBM4 is strong, it is also responding to additional growth in HBM3E demand....
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16.01.26 - 06:06
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Taiwan′s semiconductor test solution sector set for rapid growth amid AI chip demand surge (Digitimes)
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Taiwan's semiconductor test solution providers are poised for strong growth in 2025, driven by rising demand for AI, HPC, and ASICs. With wafer foundries and OSAT providers expanding capacity, firms like MPI Corp., WinWay Technology, Chunghwa Precision Test Tech., Keystone Microtech, and Hermes Testing Solutions have reported record annual revenues, highlighting the sector's robust momentum....
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12.01.26 - 16:30
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Co-Packaged Optics Market Report 2026-2036: Product Benchmarking of Spectrum-X, Quantum-X, and Bailly Platforms, Start-Up Innovation Mapping, and Foundry Comparisons - ResearchAndMarkets.com (Business Wire)
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DUBLIN--(BUSINESS WIRE)--The "The Global Co-Packaged Optics Market 2026-2036" report has been added to ResearchAndMarkets.com's offering.
The Global Co-Packaged Optics Market 2026-2036 delivers comprehensive analysis of the rapidly emerging CPO industry, examining how this transformative technology is reshaping data centre interconnect architecture to meet the unprecedented bandwidth demands of artificial intelligence and machine learning workloads.
As hyperscale operators and AI infrastructure providers confront critical limitations in power consumption, latency, and bandwidth density with conventional pluggable optical modules, co-packaged optics has emerged as the definitive next-generation solution, integrating optical transceivers directly with switch ASICs and accelerators to achieve dramatic improvements in performance and efficiency.
This authoritative report provides semiconductor industry professionals, investors, data centre operators, and technology strategists with detailed market forecasts ...
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