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05.09.25 - 01:00
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Commentary: Advanced AI packaging driving semiconductor industry toward ′virtual integration′ (Digitimes)
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Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs) have seen advanced back-end packaging costs reach US$4.1 billion, accounting for 46% of the total process cost structure—nearly matching wafer foundry costs at US$4.8 billion. This has caused the front-end process share to drop significantly to 54%, leaving only an 8% gap between the two....
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04.09.25 - 00:30
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Research Insights: ASICs, packaging, and HBM reshape the AI chip race (Digitimes)
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The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized" phase shaped by three forces: the expansion of custom ASICs, diversification of advanced packaging, and intensifying competition in high-bandwidth memory (HBM) pricing....
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25.08.25 - 05:06
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New chipmakers face uphill battle despite surging ASIC demand (Digitimes)
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Nvidia currently holds a dominant position in the cloud AI GPU computing market. However, there is a growing demand for specialized chips known as application-specific integrated circuits (ASICs), which is recognized as the next major area of growth. More semiconductor companies are entering this market, with notable players including MediaTek, Broadcom, Marvell, and Alchip. Nevertheless, industry insiders acknowledge that new entrants in the so-called "second tier" face significant challenges in generating immediate revenue....
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21.08.25 - 10:06
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Taiwan′s MPI grabs first-mover advantage in MEMS probe cards for AI chips (Digitimes)
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Taiwan's MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip development and drive demand for advanced wafer probe cards. Starting in 2026, Google and Amazon Web Services (AWS) are expected to lead a surge in CoWoS advanced packaging capacity, powered by their in-house AI application-specific integrated circuits (ASICs). These chips have already progressed from 7nm to 5nm and 4nm, with the next wave targeting sub-3nm nodes....
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14.08.25 - 05:06
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Alchip sees profit dip as 7nm cycle ends, bets on 3nm AI chips for growth (Digitimes)
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Alchip Technologies, a leading provider of high-performance ASICs, reported a sharp decline in second-quarter net profit on August 13, citing lower-than-expected volume production and delays in revenue recognition from non-recurring engineering (NRE) projects. Net profit for the period came in at NT$1.323 billion (approx. US$44 million), down 9.6% quarter-over-quarter and 16.6% year-over-year....
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14.08.25 - 03:36
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Asics President on FY Forecast, Business Strategy (Bloomberg)
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Mitsuyuki Tominaga, President and COO at Asics, discusses the company's business strategy after it raised its full-year forecast. The sportswear maker said earnings are seen rising faster than previously expected due to strong performance in its running, sports style and Onitsuka Tiger categories and reduced uncertainty around US tariffs. He speaks with Avril Hong and Paul Allen on "Bloomberg: The Asia Trade".
(Source: Bloomberg)...
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06.08.25 - 13:03
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AST SpaceMobile Announces Agreement to Acquire Global S-Band Spectrum Priority Rights Held under the International Telecommunication Union (Business Wire)
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Alongside the company's core global 3GPP cellular spectrum strategy, and planned L-Band spectrum strategies in the U.S. and Canada, S-Band would further expand spectrum access globally
Transaction would pair AST SpaceMobile's largest-ever commercial communication arrays deployed in low Earth orbit with up to an additional 60 MHz of mid-band satellite spectrum capabilitiesMIDLAND, Texas--(BUSINESS WIRE)--$ASTS #AST--AST SpaceMobile, Inc. (“AST SpaceMobile”) (NASDAQ: ASTS), the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones, designed for both commercial and government applications, today announced an agreement to acquire global S-Band spectrum priority rights held under the International Telecommunication Union (ITU).
“Our revolutionary satellites and proprietary ASICs were designed with S-Band capabilities in mind. With these new spectrum priority rights, we will be in a position to bring services in S-Band to targeted markets ...
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05.08.25 - 23:33
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CHELSIO ANNOUNCES BROAD SAMPLING OF T7 DPU PLATFORM (PR Newswire)
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Next-Generation DPU Delivers High-Performance Offloads for Storage, Security, and AI at 400G SUNNYVALE, Calif., Aug. 5, 2025 /PRNewswire/ -- Chelsio Communications, Inc., a leading provider of high-performance (1/10/25/40/50/100/200/400Gb) Ethernet Unified Wire ASICs and Adapters for......
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24.07.25 - 01:00
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AI server boom runs into fiberglass bottleneck (Digitimes)
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As the four major cloud service providers (CSPs) actively invest in self-developed application-specific integrated circuits (ASICs), market forecasts predict a rapid increase in shipments in 2025. However, the integrated circuit substrate supply chain has indicated concerns over potential upstream material shortages following reports that Japan's leading fiberglass cloth manufacturer Nittobo is facing high-end production capacity constraints. This could potentially hinder future server shipments....
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23.07.25 - 05:06
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MediaTek reportedly wins Meta′s new 2nm ASIC order, aiming for 1H27 mass production (Digitimes)
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MediaTek and Broadcom continue to compete for Meta's new application-specific integrated circuit (ASIC) projects, with industry insiders stressing that both companies are performing at a comparable level. However, recent reports suggest that MediaTek is poised to secure a major order for one of Meta's upcoming 2nm process ASICs, codenamed "Arke," which focuses on post-training and inference functions, potentially moving toward mass production in the first half of 2027....
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16.07.25 - 01:06
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Taiwan′s PCB supply chain gains momentum as AI & ASIC server shipments surge (Digitimes)
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AI server GB200 has begun volume shipments, and cloud service providers (CSPs) are ramping up demand for servers equipped with their own ASICs. Despite reciprocal tariffs and New Taiwan Dollar exchange rate losses, server suppliers including Unimicron, Gold Circuit Electronics (GCE), Hi-tec, and Tripod have reported revenue growth in the second quarter of 2025....
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07.07.25 - 00:54
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Rising AI ASIC use drives surge in SLT chip testing; Market to grow 30% in 2026 (Digitimes)
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As artificial intelligence fuels rapid growth in high-performance computing, it's also triggering a shift in how semiconductor chips are tested. Beyond leading AI GPU makers, major cloud providers—known as hyperscalers—are doubling down on custom-built AI chips, or ASICs, sparking a sharp rise in demand for system-level testing, or SLT. These tests are designed to handle the higher speeds and power levels of next-generation processors....
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