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02.10.26 - 02:07
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CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era (Digitimes)
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Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note that the era of a single design partner handling an ASIC project end-to-end is largely over, replaced by a co-design model where vendors compete for functional silicon footprint within single-chip architectures....
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30.09.26 - 01:09
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Corporate News: ASICS (EQS)
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ASICS MACHT AUF WELTWEITEN BEWEGUNGSMANGEL AUFMERKSAM – NEUE STUDIE ZEIGT, DASS BEWEGUNG AUS UNSEREM ALLTAG VERSCHWINDET...
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24.09.26 - 02:30
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Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use (Digitimes)
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Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity tool into deeper uses in core business workflows. In addition to token consumption and model costs, Microsoft Taiwan general manager Sean Pien points out that corporations are also examining how AI actually benefits workflows and innovation, making return-on-investment (ROI) evaluations harder to judge solely on the basis of time or labor savings....
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16.09.26 - 02:48
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NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures (Digitimes)
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DIGITIMES observed that Nvidia's newly announced NVHBM is not a brand-new memory technology, but rather an extension of existing custom HBM (cHBM). It is a managed cHBM design that moves the memory controller, which originally sat on the XPU, into the HBM logic base die, and pairs it with custom physical-layer (PHY) and die-to-die (D2D) interfaces. In strategic terms, Nvidia is extending its moat from GPUs to the memory architecture of custom ASICs, and is trying to define how future custom AI chips connect to memory, hook into scale-up networks, and come together as complete AI racks....
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10.09.26 - 08:06
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Intelligo targets double-digit 2027 revenue growth on AI IP, ASICs (Digitimes)
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Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles and smart glasses. The company said edge AI demand is rising even as AI data centers absorb semiconductor capacity and supply-chain resources....
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03.09.26 - 12:06
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CHPT spans wafer to system-level testing (Digitimes)
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Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory probe cards, high-pin-count probe cards, and a high-power burn-in board for AI ASICs....
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26.08.26 - 08:45
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ASICS Europe Expands Global Partnership with Teamwork Commerce (PR Newswire)
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LONDON, Aug. 26, 2026 /PRNewswire/ -- Teamwork Commerce, a global provider of omnichannel retail solutions, today announced that ASICS Europe has joined the growing list of ASICS regions leveraging the Teamwork Commerce platform. This expansion reflects Teamwork Commerce's continued......
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25.08.26 - 05:06
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Commentary: Nvidia′s 15% hike piles pressure on the AI supply chain, lifts ASIC prospects (Digitimes)
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Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027, including Grace Blackwell and the next-generation Vera Rubin platform. The move is expected to ripple through the chip and system supply chain, while industry figures say it could also lift the appeal of inference ASICs....
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24.08.26 - 01:54
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AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint (Digitimes)
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AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint expects more than 130 million GPUs and AI ASICs to shift toward advanced-packaged on-compute memory over the next five years, as the industry braces for nearly US$2 trillion in compute revenue and an intensifying battle over packaging capacity....
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17.08.26 - 02:06
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Sigurd tops NT$2B in July revenue as AI testing demand surges (Digitimes)
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Sigurd Microelectronics, an IC testing and packaging company, reported record July 2026 revenue and said demand from AI and AI connectivity markets drove the result. The company said orders for high-performance computing chips, including CPUs, GPUs, ASICs, and AI accelerators, lifted testing demand for silicon photonics, high-speed networking, memory, silicon capacitors, baseboard management controller chips, and high-end power management ICs used in AI servers and data centers....
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17.08.26 - 02:06
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T-glass demand surges as IC substrate makers see shortages through 2028 (Digitimes)
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As the global AI computing infrastructure boom drives rapid demand growth for GPUs, CPUs, and ASICs, the ABF substrate industry is set to swing into shortage in 2026, with the supply-demand gap expected to widen in 2027-2028. That has lifted order visibility for IC substrate makers in Taiwan, Japan, and South Korea, with the outlook now stretching as far as 2029-2030. Companies including Ibiden, Unimicron, Kinsus, Nan Ya Printed Circuit Board, Leading, and Samsung Electro-Mechanics are all moving into a new round of capacity expansion....
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14.08.26 - 07:36
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ASICS Corporation H1 Income Rises (AFX)
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TOKYO (dpa-AFX) - ASICS Corporation (ASCCY) released a profit for its first half that Increased, from the same period last yearThe company's bottom line came in at JPY82.171 billion, or JPY115.84 ......
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07.08.26 - 19:36
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Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth (Business Wire)
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SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel Corporation today announced the appointment of Dean Jarnac as executive vice president and chief sales officer. Jarnac will lead Intel's global sales organization—strengthening Intel's customer relationships and go-to-market execution across its product portfolio, including client, data center, AI, networking, and ASICs.
“Customer focus and execution are central to Intel's strategy and future success,” said Lip-Bu Tan, Intel CEO. “Dean is a proven leader with deep industry relationships and a strong track record of building high-performance sales organizations. His customer-first mindset, operational discipline, and extensive semiconductor experience will help us deepen customer partnerships and accelerate growth across our business.”
Jarnac joins Intel from Marvell, where he served as chief sales officer and was responsible for the company's worldwide sales, field application engineering, and sales operations organizations. Prior to Marvell, Jarna...
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